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1. WO2020107874 - MICRO LIGHT-EMITTING DIODE ARRAY DEVICE, TRANSFERRING APPARATUS AND TRANSFERRING METHOD

Publication Number WO/2020/107874
Publication Date 04.06.2020
International Application No. PCT/CN2019/092148
International Filing Date 20.06.2019
IPC
H01L 27/15 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
15including semiconductor components with at least one potential-jump barrier or surface barrier, specially adapted for light emission
CPC
H01L 27/15
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
15including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
H01L 33/00
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
Applicants
  • 昆山工研院新型平板显示技术中心有限公司 KUNSHAN NEW FLAT PANEL DISPLAY TECHNOLOGY CENTER CO., LTD [CN]/[CN]
  • 昆山国显光电有限公司 KUNSHAN GO-VISIONOX OPTO-ELECTRONICS CO., LTD [CN]/[CN]
Inventors
  • 程卫高 CHENG, Weigao
  • 任雅磊 REN, Yalei
Agents
  • 广东君龙律师事务所 GUANGDONG JUNLONG LAW FIRM
Priority Data
201811457388.230.11.2018CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) MICRO LIGHT-EMITTING DIODE ARRAY DEVICE, TRANSFERRING APPARATUS AND TRANSFERRING METHOD
(FR) DISPOSITIF DE RÉSEAU DE MICRO-DIODES ÉLECTROLUMINESCENTES, APPAREIL DE TRANSFERT ET PROCÉDÉ DE TRANSFERT
(ZH) 微发光二极管阵列器件、转移装置及转移方法
Abstract
(EN)
Provided in the present application are a micro light-emitting diode array device, a transferring apparatus and a transferring method. The array device comprises a micro light-emitting diode array; a supporting layer located on the micro light-emitting diode array and covering micro light-emitting diodes, wherein the supporting layer is a material that is sublimated easily after being heated; and a magnetic material layer located on one side, away from the micro light-emitting diode array, of the supporting layer, thereby achieving the objective that the micro light-emitting diode array device will not be damaged during transfer and is easy to clean at the end of the transfer.
(FR)
La présente invention concerne un dispositif de réseau de micro-diodes électroluminescentes, un appareil de transfert et un procédé de transfert. Le dispositif de réseau comprend un réseau de micro-diodes électroluminescentes ; une couche de support située sur le réseau de micro-diodes électroluminescentes et recouvrant des micro-diodes électroluminescentes, la couche de support étant un matériau qui est sublimé facilement après avoir été chauffé ; et une couche de matériau magnétique située sur un côté, à l'opposé du réseau de micro-diodes électroluminescentes, de la couche de support, ce qui permet d'atteindre l'objectif selon lequel le dispositif de réseau de micro-diodes électroluminescentes ne sera pas endommagé pendant le transfert et est facile à nettoyer à la fin du transfert.
(ZH)
本申请提供微发光二极管阵列器件、转移装置及转移方法。阵列器件包括微发光二极管阵列;位于所述微发光二极管阵列上且覆盖所述微发光二极管的支撑层,所述支撑层为受热后易升华材料;位于所述支撑层远离所述微发光二极管阵列一侧的磁性材料层,以此实现在转移微发光二极管阵列器件时使其不受损伤以及在转移结束后易于清理的目的。
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