Processing

Please wait...

Settings

Settings

Goto Application

1. WO2020107809 - LED CHIP, AND ASSEMBLY APPARATUS AND ASSEMBLY METHOD FOR DISPLAY PANEL

Publication Number WO/2020/107809
Publication Date 04.06.2020
International Application No. PCT/CN2019/086058
International Filing Date 08.05.2019
IPC
H01L 21/683 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
683for supporting or gripping
H01L 33/00 2010.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
CPC
H01L 21/683
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
683for supporting or gripping
H01L 33/00
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
Applicants
  • 昆山工研院新型平板显示技术中心有限公司 KUNSHAN NEW FLAT PANEL DISPLAY TECHNOLOGY CENTER CO., LTD [CN]/[CN]
  • 昆山国显光电有限公司 KUNSHAN GO-VISIONOX OPTO-ELECTRONICS CO., LTD [CN]/[CN]
Inventors
  • 郭双 GUO, Shuang
  • 田文亚 TIAN, Wenya
Agents
  • 广东君龙律师事务所 GUANGDONG JUNLONG LAW FIRM
Priority Data
201811446284.129.11.2018CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) LED CHIP, AND ASSEMBLY APPARATUS AND ASSEMBLY METHOD FOR DISPLAY PANEL
(FR) PUCE DE DEL, ET APPAREIL D'ASSEMBLAGE ET PROCÉDÉ D'ASSEMBLAGE POUR PANNEAU D'AFFICHAGE
(ZH) 一种LED芯片、显示面板的组装设备及组装方法
Abstract
(EN)
An LED chip (1), and an assembly apparatus and an assembly method for a display panel. The LED chip (1) comprises a chip main body (10) and a magnetic member (12) arranged on the chip main body (10). The magnetic member (12) can be attracted under the action of a magnetic attraction force. The chip main body (10) comprises a substrate and an epitaxial layer structure provided on the substrate. The magnetic member (12) is located on the side, away from the substrate, of the epitaxial layer structure.
(FR)
L'invention concerne une puce de DEL (1), et un appareil d'assemblage et un procédé d'assemblage pour un panneau d'affichage. La puce de DEL (1) comprend un corps principal de puce (10) et un élément magnétique (12) disposé sur le corps principal de puce (10). L'élément magnétique (12) peut être attiré sous l'action d'une force d'attraction magnétique. Le corps principal de puce (10) comprend un substrat et une structure de couche épitaxiale disposée sur le substrat. L'élément magnétique (12) est situé sur le côté, à l'opposé du substrat, de la structure de couche épitaxiale.
(ZH)
一种LED芯片(1)、显示面板的组装设备及组装方法。LED芯片(1)包括芯片主体(10)以及设置于芯片主体(10)上的磁性件(12),磁性件(12)能在磁性吸附力的作用下被吸附。芯片主体(10)包括衬底以及设置于衬底上的外延层结构,磁性件(12)位于所述外延层结构远离所述衬底一侧。
Also published as
Latest bibliographic data on file with the International Bureau