Processing

Please wait...

Settings

Settings

Goto Application

1. WO2020107802 - SEMICONDUCTOR DEVICE, TERMINAL DEVICE, CAMERA, AND LIGHT MODULE

Publication Number WO/2020/107802
Publication Date 04.06.2020
International Application No. PCT/CN2019/084751
International Filing Date 28.04.2019
IPC
H01L 51/52 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
52Details of devices
CPC
H01L 27/146
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
14including semiconductor components sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
144Devices controlled by radiation
146Imager structures
H01L 27/32
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes [OLED]
H01L 31/0203
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
31Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof
02Details
0203Containers; Encapsulations ; , e.g. encapsulation of photodiodes
H01L 31/0224
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
31Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof
02Details
0224Electrodes
H01L 31/048
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
31Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof
04adapted as photovoltaic [PV] conversion devices
042PV modules or arrays of single PV cells
048Encapsulation of modules
H01L 51/52
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED]
52Details of devices
Applicants
  • 华为技术有限公司 HUAWEI TECHNOLOGIES CO., LTD. [CN]/[CN]
Inventors
  • 吕泉 LYU, Quan
  • 徐刚 XU, Gang
  • 刘书毅 LIU, Shuyi
Agents
  • 深圳市深佳知识产权代理事务所(普通合伙) SHENPAT INTELLECTUAL PROPERTY AGENCY
Priority Data
201811427060.627.11.2018CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) SEMICONDUCTOR DEVICE, TERMINAL DEVICE, CAMERA, AND LIGHT MODULE
(FR) DISPOSITIF À SEMI-CONDUCTEUR, DISPOSITIF TERMINAL, CAMÉRA ET MODULE LUMINEUX
(ZH) 一种半导体器件、终端设备、相机、光模块
Abstract
(EN)
Disclosed in the present application is a semiconductor device, wherein in the semiconductor device, a barrier layer is disposed between a top transparent electrode, i.e. a second electrode, and a bottom functional layer; the barrier layer may act as a barrier protective layer of the bottom functional layer, and may effectively prevent impact damage to the bottom functional layer during an electrode preparation process, which is beneficial in increasing the yield and reliability of a device. Additionally, further disclosed in the present application are a terminal device comprising the semiconductor device, a camera, and a light module.
(FR)
La présente invention concerne un dispositif à semi-conducteur, dans lequel, dans le dispositif à semi-conducteur, une couche barrière est disposée entre une électrode transparente supérieure, c'est-à-dire une seconde électrode, et une couche fonctionnelle inférieure; la couche barrière peut agir comme une couche protectrice barrière de la couche fonctionnelle inférieure, et peut empêcher efficacement un endommagement par impact de la couche fonctionnelle inférieure pendant un processus de préparation d'électrode, ce qui est avantageux pour augmenter le rendement et la fiabilité d'un dispositif. De plus, la présente invention concerne en outre un dispositif terminal comprenant le dispositif semi-conducteur, une caméra et un module lumineux.
(ZH)
本申请公开了一种半导体器件,在该半导体器件中,在顶透明电极即第二电极以及底部功能层之间设置有阻隔层,该阻隔层可以作为底部功能层的阻隔保护层,能够有效防止顶电极制备过程中对底部功能层的冲击损坏,有利于提升器件良率和可靠性。此外,本申请还公开了一种包含该半导体器件的终端设备、相机和光模块。
Also published as
Latest bibliographic data on file with the International Bureau