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1. WO2020107790 - POLYVINYLIDENE FLUORIDE PIEZOELECTRIC MATERIAL, PREPARATION METHOD THEREFOR, AND FINGERPRINT RECOGNITION MODULE

Publication Number WO/2020/107790
Publication Date 04.06.2020
International Application No. PCT/CN2019/084240
International Filing Date 25.04.2019
IPC
C09D 127/16 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
127Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers
02not modified by chemical after-treatment
12containing fluorine atoms
16Homopolymers or copolymers of vinylidene fluoride
C09D 7/61 2018.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
7Features of coating compositions, not provided for in group C09D5/88; Processes for incorporating ingredients in coating compositions
40Additives
60non-macromolecular
61inorganic
G06K 9/00 2006.01
GPHYSICS
06COMPUTING; CALCULATING OR COUNTING
KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
9Methods or arrangements for reading or recognising printed or written characters or for recognising patterns, e.g. fingerprints
C08L 27/16 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
27Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
02not modified by chemical after-treatment
12containing fluorine atoms
16Homopolymers or copolymers of vinylidene fluoride
CPC
C08K 2003/0831
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
3Use of inorganic substances as compounding ingredients
02Elements
08Metals
0831Gold
C08K 2201/011
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
2201Specific properties of additives
011Nanostructured additives
C09D 127/16
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
127Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers
02not modified by chemical after-treatment
12containing fluorine atoms
16Homopolymers or copolymers of vinylidene fluoride
C09D 7/61
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
7Features of coating compositions, not provided for in group C09D5/00
40Additives
60non-macromolecular
61inorganic
C09D 7/70
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
7Features of coating compositions, not provided for in group C09D5/00
40Additives
70characterised by shape, e.g. fibres, flakes or microspheres
G06K 9/0002
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
9Methods or arrangements for reading or recognising printed or written characters or for recognising patterns, e.g. fingerprints
00006Acquiring or recognising fingerprints or palmprints
00013Image acquisition
0002by non-optical methods, e.g. by ultrasonic or capacitive sensing
Applicants
  • 武汉华星光电技术有限公司 WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. [CN]/[CN]
Inventors
  • 周永祥 ZHOU, Yongxiang
Agents
  • 深圳翼盛智成知识产权事务所(普通合伙) ESSEN PATENT&TRADEMARK AGENCY
Priority Data
201811446413.729.11.2018CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) POLYVINYLIDENE FLUORIDE PIEZOELECTRIC MATERIAL, PREPARATION METHOD THEREFOR, AND FINGERPRINT RECOGNITION MODULE
(FR) MATÉRIAU PIÉZOÉLECTRIQUE À BASE DE POLY(FLUORURE DE VINYLIDÈNE), SON PROCÉDÉ DE PRÉPARATION, ET MODULE DE RECONNAISSANCE D'EMPREINTES DIGITALES
(ZH) 聚偏氟乙烯压电材料及其制备方法、指纹识别模组
Abstract
(EN)
Disclosed is a polyvinylidene fluoride piezoelectric material, comprising the following components in parts by weight: 3-18% of polyvinylidene fluoride, 31-54% of a first solvent, 26-63% of a second solvent, 2-4% of a fluorine-containing surfactant, and 0.01-0.1% of an inducing material, wherein the inducing material is one of carbon nanotubes, carbon black, and gold nanorods. A method for preparing the polyvinylidene fluoride piezoelectric material using same comprises: providing a thin film transistor substrate, providing the polyvinylidene fluoride piezoelectric material, coating same on one surface of the thin film transistor substrate, and carrying out polarization treatment. A fingerprint recognition module containing the polyvinylidene fluoride piezoelectric material comprises: a thin film transistor substrate and a piezoelectric thin film layer coated thereon, wherein the piezoelectric thin film layer contains the polyvinylidene fluoride piezoelectric material.
(FR)
L'invention concerne un matériau piézoélectrique à base de poly(fluorure de vinylidène), comprenant les constituants suivants en parties en poids : 3 à 18 % de poly(fluorure de vinylidène), 31 à 54 % d'un premier solvant, 26 à 63 % d'un second solvant, 2 à 4 % d'un tensioactif contenant du fluor, et 0,01 à 0,1 % d'un matériau inducteur, le matériau inducteur étant un matériau parmi des nanotubes de carbone, le noir de carbone et des nanotiges d'or. Un procédé de préparation du matériau piézoélectrique à base de poly(fluorure de vinylidène) l'utilisant comprend : la fourniture d'un substrat de transistor à film mince, la fourniture du matériau piézoélectrique à base de poly(fluorure de vinylidène), le revêtement de ce dernier sur une surface du substrat de transistor à film mince, et la réalisation d'un traitement de polarisation. Un module de reconnaissance d'empreinte digitale contenant le matériau piézoélectrique à base de poly(fluorure de vinylidène) comprend : un substrat de transistor à film mince et une couche de film mince piézoélectrique revêtue sur ce dernier, la couche de film mince piézoélectrique contenant le matériau piézoélectrique à base de poly(fluorure de vinylidène).
(ZH)
一种聚偏氟乙烯压电材料,按照重量份数包括:聚偏氟乙烯 3-18%,第一溶剂 31-54%,第二溶剂 26-63%,含氟表面活性剂 2-4%,诱导材料 0.01-0.1%;该诱导材料为碳纳米管、炭黑和金纳米棒中的一种。用其制备聚偏氟乙烯压电材料的方法包括:提供薄膜晶体管基板,提供该聚偏氟乙烯压电材料,将其涂覆在薄膜晶体管基板的一表面,进行极化处理。包含该聚偏氟乙烯压电材料的指纹识别组,包括:薄膜晶体管基板和覆于其上的压电薄膜层,该压电薄膜层包含该聚偏氟乙烯压电材料。
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