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1. WO2020107787 - MANUFACTURING METHOD FOR MESH

Publication Number WO/2020/107787
Publication Date 04.06.2020
International Application No. PCT/CN2019/084084
International Filing Date 24.04.2019
IPC
H01L 33/62 2010.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
62Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
H01L 27/15 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
15including semiconductor components with at least one potential-jump barrier or surface barrier, specially adapted for light emission
CPC
H01L 27/156
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
15including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
153in a repetitive configuration, e.g. LED bars
156two-dimensional arrays
H01L 2933/0066
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2933Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
0008Processes
0066relating to arrangements for conducting electric current to or from the semiconductor body
H01L 33/62
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
62Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Applicants
  • 武汉华星光电技术有限公司 WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. [CN]/[CN]
Inventors
  • 张桂洋 ZHANG, Guiyang
Agents
  • 深圳市德力知识产权代理事务所 COMIPS INTELLECTUAL PROPERTY OFFICE
Priority Data
201811437607.028.11.2018CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) MANUFACTURING METHOD FOR MESH
(FR) PROCÉDÉ DE FABRICATION DE MAILLE
(ZH) 网孔的制作方法
Abstract
(EN)
Provided is a manufacturing method for mesh, the manufacturing method comprising: providing a plurality of first portions (10) extending in a horizontal direction and parallel to each other, and a plurality of second portions (20) extending in a vertical direction and parallel to each other, wherein the material of the first portions (10) and the second portions (20) is one of a magnet and a magnetic material (S1); adjusting the positions of the plurality of first portions (10) and the plurality of second portions (20) according to preset positions of the opening areas to stagger each other to form a plurality of opening areas (30) (S2), achieving the dynamic adjustment of the positions of the opening areas, achieving a mesh corresponding to multiple LED arrangements, that is, the mesh and LED arrangement are in a “one-to-many” relationship, improving the applicability of the mesh, greatly reducing the production cost, and no waste material and waste gas are produced in the manufacturing process, which has the feature of energy saving and environmental protection.
(FR)
La présente invention concerne un procédé de fabrication de maille, le procédé de fabrication comprenant les étapes consistant à : fournir une pluralité de premières parties (10) s'étendant dans une direction horizontale et parallèles les unes aux autres, et une pluralité de secondes parties (20) s'étendant dans une direction verticale et parallèles les unes aux autres, le matériau des premières parties (10) et des secondes parties (20) étant un aimant ou un matériau magnétique (S1) ; ajuster les positions de la pluralité de premières parties (10) et de la pluralité de secondes parties (20) selon des positions prédéfinies des zones d'ouverture pour les décaler les unes des autres afin de former une pluralité de zones d'ouverture (30) (S2), effectuer l'ajustement dynamique des positions des zones d'ouverture, réaliser une maille correspondant à de multiples agencements de DEL, la maille et l'agencement de DEL étant dans une relation « un vers plusieurs », ce qui permet d'améliorer l'applicabilité de la maille, de réduire considérablement le coût de production, et d'éviter la production de déchet et gaz résiduaire dans le procédé de fabrication, ce qui permet d'économiser de l'énergie et de protéger l'environnement.
(ZH)
一种网孔的制作方法,该网孔的制作方法通过沿水平方向延伸且相互平行的多个第一部(10)以及沿垂直方向延伸且相互平行的多个第二部(20);所述第一部(10)与第二部(20)的材料分别为磁体和磁性材料中的一种(S1),根据预设的开口区的位置调节所述多个第一部(10)与多个第二部(20)的位置以相互交错形成多个开口区(30)(S2),实现动态调节开口区的位置,实现一张网孔对应多种LED排列方式,即网孔与LED排列方式是"一对多"的关系,提高网孔的适用性,极大的降低生产成本,并且制作过程无废料和废气产生,具有节能环保的特性。
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