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1. WO2020107752 - DISPLAY STRUCTURE AND MANUFACTURING METHOD THEREFOR

Publication Number WO/2020/107752
Publication Date 04.06.2020
International Application No. PCT/CN2019/079076
International Filing Date 21.03.2019
IPC
H01L 27/32 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
CPC
G09F 9/33
GPHYSICS
09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
9Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
30in which the desired character or characters are formed by combining individual elements
33being semiconductor devices, e.g. diodes
H01L 2227/323
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2227Indexing scheme for devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate covered by group H01L27/00
32Devices including an organic light emitting device [OLED], e.g. OLED display
323Multistep processes for AMOLED
H01L 27/3276
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes [OLED]
3241Matrix-type displays
3244Active matrix displays
3276Wiring lines
Applicants
  • 武汉华星光电半导体显示技术有限公司 WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. [CN]/[CN]
Inventors
  • 翁金学 WENG, Jinxue
Agents
  • 深圳翼盛智成知识产权事务所(普通合伙) ESSEN PATENT&TRADEMARK AGENCY
Priority Data
201811430589.328.11.2018CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) DISPLAY STRUCTURE AND MANUFACTURING METHOD THEREFOR
(FR) STRUCTURE D’AFFICHAGE ET SON PROCÉDÉ DE FABRICATION
(ZH) 显示器结构及其制造方法
Abstract
(EN)
A display structure and a manufacturing method. The display structure includes a substrate (21), a display element layer (22), an insulating protection layer (35), multiple display signal lines (23), multiple first connection pads (24) and a chip-on-film packaging member (25), wherein the first connection pads (24) are arranged on a back face of the substrate (21) and are connected to the multiple display signal lines (23); and the chip-on-film packaging member (25) is provided with multiple second connection pads (26), and are electrically connected to the multiple first connection pads (24). The second connection pads (26) on the chip-on-film packaging member (25) are connected to the first connection pads (24) on the back face of a display panel so as to increase the screen-to-body ratio of a display without bending the display.
(FR)
L’invention concerne une structure d’affichage et un procédé de fabrication. La structure d’affichage inclut un substrat (21), une couche d’éléments d’affichage (22), une couche de protection isolante (35), de multiples lignes de signaux d’affichage (23), de multiples premières pastilles de connexion (24) et un organe de conditionnement de puce sur pellicule (25), les premières pastilles de connexion (24) étant agencées sur une face arrière du substrat (21) et étant connectées aux multiples lignes de signaux d’affichage (23) ; et l’organe de conditionnement de puce sur pellicule (25) comporte de multiples deuxièmes pastilles de connexion (26), qui sont connectées électriquement aux multiples premières pastilles de connexion (24). Les deuxièmes pastilles de connexion (26) sur l’organe de conditionnement de puce sur pellicule (25) sont connectées aux premières pastilles de connexion (24) sur la face arrière d’un panneau d’affichage afin d’accroître le ratio entre l’écran et le corps d’un afficheur sans tordre l’afficheur.
(ZH)
一种显示器结构及制造方法。所述显示器结构包含一基板(21)、一显示器元件层(22)、一绝缘保护层(35)、多条显示信号线(23)、多个第一连接垫(24)及一覆晶薄膜封装件(25);所述第一连接垫(24)设置在基板(21)背面上,并与所述多条显示信号线(23)相连接;所述覆晶薄膜封装件(25)具有多个第二连接垫(26),与所述多个第一连接垫(24)电性连接。通过将覆晶薄膜封装件(25)上的第二连接垫(26)与显示面板背面的第一连接垫(24)相连接,以达到不用弯折显示器,从而提高显示器的屏占比。
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