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1. WO2020107722 - SUBSTRATE CUTTING DEVICE AND SUBSTRATE CUTTING METHOD

Publication Number WO/2020/107722
Publication Date 04.06.2020
International Application No. PCT/CN2019/075602
International Filing Date 20.02.2019
IPC
C03B 33/02 2006.01
CCHEMISTRY; METALLURGY
03GLASS; MINERAL OR SLAG WOOL
BMANUFACTURE OR SHAPING OF GLASS, OR OF MINERAL OR SLAG WOOL; SUPPLEMENTARY PROCESSES IN THE MANUFACTURE OR SHAPING OF GLASS, OR OF MINERAL OR SLAG WOOL
33Severing cooled glass
02Cutting or splitting sheet glass; Apparatus or machines therefor
G02F 1/13 2006.01
GPHYSICS
02OPTICS
FDEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH IS MODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THE DEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY, COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g. SWITCHING, GATING, MODULATING OR DEMODULATING; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF; FREQUENCY-CHANGING; NON-LINEAR OPTICS; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
1Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
01for the control of the intensity, phase, polarisation or colour
13based on liquid crystals, e.g. single liquid crystal display cells
CPC
C03B 33/02
CCHEMISTRY; METALLURGY
03GLASS; MINERAL OR SLAG WOOL
BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
33Severing cooled glass
02Cutting or splitting sheet glass ; or ribbons; Apparatus or machines therefor
G02F 1/1303
GPHYSICS
02OPTICS
FDEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH IS MODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THE DEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY, COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g. SWITCHING, GATING, MODULATING OR DEMODULATING; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF; FREQUENCY-CHANGING; NON-LINEAR OPTICS; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
1Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating, or modulating; Non-linear optics
01for the control of the intensity, phase, polarisation or colour 
13based on liquid crystals, e.g. single liquid crystal display cells
1303Apparatus specially adapted to the manufacture of LCDs
G02F 1/133351
GPHYSICS
02OPTICS
FDEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH IS MODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THE DEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY, COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g. SWITCHING, GATING, MODULATING OR DEMODULATING; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF; FREQUENCY-CHANGING; NON-LINEAR OPTICS; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
1Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating, or modulating; Non-linear optics
01for the control of the intensity, phase, polarisation or colour 
13based on liquid crystals, e.g. single liquid crystal display cells
133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
1333Constructional arrangements; ; Manufacturing methods
133351Manufacturing of individual cells out of a plurality of cells, e.g. by dicing
Applicants
  • 深圳市华星光电半导体显示技术有限公司 SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. [CN]/[CN]
Inventors
  • 苑春歌 YUAN, Chunge
Agents
  • 深圳市德力知识产权代理事务所 COMIPS INTELLECTUAL PROPERTY OFFICE
Priority Data
201811420675.626.11.2018CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) SUBSTRATE CUTTING DEVICE AND SUBSTRATE CUTTING METHOD
(FR) DISPOSITIF DE DÉCOUPE DE SUBSTRAT ET PROCÉDÉ DE DÉCOUPE DE SUBSTRAT
(ZH) 基板切割装置及基板切割方法
Abstract
(EN)
A substrate cutting device and a substrate cutting method. The substrate cutting device comprises: a splitting unit (10), a cutter wheel (20) provided on one side of the splitting unit (10), and a laser detection generator (30). When the substrate cutting device cuts a substrate (40) to be cut, the laser detection generator (30) detects whether a metal layer (42) exists at the position of a cut line (41) of the substrate (40) to be cut, and generates, when a metal layer (42) is detected, a laser to cut the metal layer (42); the cutter wheel (20) cuts a part of the substrate (40) to be cut along the cut line (41), so as to generate a crack on the substrate (40) to be cut at the position of the cut line (41); the splitting unit (10) continuously expands the crack until an area (43) to be removed of the cut substrate (40) is completely separated; and said area (43) is removed. The laser detection generator (30) cuts off the metal layer (42) before the cutter wheel (20) cuts the substrate (40) to be cut, ensuring that the splitting unit (10) can normally separate said area (43) of the cut substrate (40), facilitating the implementation of the subsequent HVA process.
(FR)
L'invention concerne un dispositif et un procédé de découpe de substrat. Le dispositif de découpe de substrat comprend : une unité de séparation (10), une roue de découpe (20) disposée d'un côté de l'unité de séparation (10) et un générateur de détection laser (30). Lorsque le dispositif de découpe de substrat découpe un substrat (40) à découper, le générateur de détection laser (30) détecte si une couche métallique (42) est présente au niveau de la position d'une ligne de découpe (41) du substrat (40) à découper, et génère, lorsqu'une couche métallique (42) est détectée, un faisceau laser pour découper la couche métallique (42) ; la roue de découpe (20) découpe une partie du substrat (40) à découper le long de la ligne de découpe (41), de manière à générer une fente sur le substrat (40) à découper au niveau de la position de la ligne de découpe (41) ; l'unité de séparation (10) élargit sans discontinuer la fente jusqu'à ce qu'une zone (43) devant être retirée du substrat découpé (40) soit complètement séparée ; et ladite zone (43) est retirée. Le générateur de détection laser (30) découpe la couche métallique (42) avant que la roue de découpe (20) découpe le substrat (40) à découper, pour garantir que l'unité de séparation (10) puisse normalement séparer ladite zone (43) du substrat découpé (40), ce qui facilite la mise en œuvre du processus HVA ultérieur.
(ZH)
一种基板切割装置及基板切割方法,其中基板切割装置包括:裂片单元(10)、设于裂片单元(10)一侧的刀轮(20)以及激光探测发生器(30);基板切割装置在切割待切割的基板(40)时,激光探测发生器(30)探测待切割的基板(40)的切割线(41)的位置是否有金属层(42),并在探测到金属层(42)时产生激光切割金属层(42),接着刀轮(20)沿着切割线(41)切割部分待切割的基板(40),使待切割的基板(40)位于切割线(41)的位置产生裂缝,接着裂片单元(10)持续扩大裂缝直至切割过的基板(40)的待去除区域(43)完全分离开,接着移除待去除区域(43),由于在刀轮(20)切割待切割的基板(40)之前,激光探测发生器(30)已经将金属层(42)切割开,保证裂片单元(10)能够正常分离切割过的基板(40)的待去除区域(43),有利于后续的HVA制程的实现。
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