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1. WO2020107673 - VAPOR DEPOSITION CARRIER PLATE AND METHOD FOR USING VAPOR DEPOSITION CARRIER PLATE TO PERFORM VAPOR DEPOSITION ON SUBSTRATE

Publication Number WO/2020/107673
Publication Date 04.06.2020
International Application No. PCT/CN2019/071327
International Filing Date 11.01.2019
IPC
C23C 14/50 2006.01
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
22characterised by the process of coating
50Substrate holders
C23C 14/24 2006.01
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
22characterised by the process of coating
24Vacuum evaporation
CPC
C23C 14/24
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
22characterised by the process of coating
24Vacuum evaporation
C23C 14/50
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
22characterised by the process of coating
50Substrate holders
Applicants
  • 武汉华星光电半导体显示技术有限公司 WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. [CN]/[CN]
Inventors
  • 刘志乔 LIU, Zhiqiao
Agents
  • 深圳翼盛智成知识产权事务所(普通合伙) ESSEN PATENT&TRADEMARK AGENCY
Priority Data
201811416418.526.11.2018CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) VAPOR DEPOSITION CARRIER PLATE AND METHOD FOR USING VAPOR DEPOSITION CARRIER PLATE TO PERFORM VAPOR DEPOSITION ON SUBSTRATE
(FR) PLAQUE DE SUPPORT DE DÉPÔT EN PHASE VAPEUR ET PROCÉDÉ D'UTILISATION DE PLAQUE DE SUPPORT DE DÉPÔT EN PHASE VAPEUR POUR EFFECTUER UN DÉPÔT EN PHASE VAPEUR SUR UN SUBSTRAT
(ZH) 蒸镀载板及利用该蒸镀载板对基板进行蒸镀的方法
Abstract
(EN)
Provided are a vapor deposition carrier plate (100) and a method for using the vapor deposition carrier plate (100) to perform vapor deposition on a substrate (200). The vapor deposition carrier plate (100) comprises: a carrier plate body (110) which is provided with a loading surface (112) for loading the substrate (200); and a plurality of protrusions (120) detachably fixed onto the loading surface (112) of the carrier plate body (110). The substrate (200) comprises a side portion (210), a transition region (220) and a display region (230). The protrusions (120) comprise: first protrusions (121, 121’), at least one of the first protrusions (121) corresponding to the transition region (220); and a second protrusion (122) corresponding to the display region (230). To lower the risk in vapor deposition process, the carrier plate body (110) and the protrusions (120) are designed to be a separable combination, thus effectively reducing the probability of bonding and risk of fragment; moreover, the problem of nonuniform attachment of a metal mask caused by bend and deformation of the substrate (200) is solved, and the occurrence of lackluster products caused by displacement of a deposited film is lowered.
(FR)
L'invention concerne une plaque de support de dépôt en phase vapeur (100) et un procédé d'utilisation de la plaque de support de dépôt en phase vapeur (100) pour effectuer un dépôt en phase vapeur sur un substrat (200). La plaque de support de dépôt en phase vapeur (100) comprend : un corps de plaque de support (110) qui est pourvu d'une surface de chargement (112) pour charger le substrat (200) ; et une pluralité de saillies (120) fixées amovibles sur la surface de chargement (112) du corps de plaque de support (110). Le substrat (200) comprend une partie latérale (210), une zone de transition (220) et une zone d'affichage (230). Les saillies (120) comprennent : des premières saillies (121, 121'), au moins une des premières saillies (121) correspondant à la zone de transition (220) ; et une seconde saillie (122) correspondant à la zone d'affichage (230). Pour réduire le risque au cours du processus de dépôt en phase vapeur, le corps de plaque de support (110) et les saillies (120) sont conçus pour être une combinaison séparable, réduisant ainsi efficacement la probabilité de liaison et de risque de fragment ; de plus, le problème de fixation non uniforme d'un masque métallique provoqué par une courbure et une déformation du substrat (200) est résolu et l'apparition de produits ternes en raison du déplacement d'un film déposé est réduite.
(ZH)
提供了一种蒸镀载板(100)及利用该蒸镀载板(100)对基板(200)进行蒸镀的方法,所述蒸镀载板(100)包括载板本体(110),具有一装载面(112),用以装载一基板(200),所述基板(200)包括边侧部(210)、过渡区(220)以及显示区(230);以及若干凸起(120),可拆卸地固定在载板本体(110)的装载面(112)上;所述凸起(120)包括第一凸起(121,121'),其中至少一个所述第一凸起(121)对应于所述过渡区(220);第二凸起(122),对应所述显示区(230)。为了改善蒸镀制程的风险,将载板本体(110)与凸起(120)分离式组合设计,有效的降低了粘片的概率,减少了破片风险,同时,改善了基板(200)因弯曲形变造成的与金属掩膜板贴合不均匀问题,从而改善了因镀膜偏移造成的部分产品发暗现象。
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