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1. WO2020107640 - MASK FOR THIN FILM PACKAGING OF FLEXIBLE OLED PANEL

Publication Number WO/2020/107640
Publication Date 04.06.2020
International Application No. PCT/CN2019/070130
International Filing Date 02.01.2019
IPC
H01L 51/56 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
56Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
CPC
C23C 14/042
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
04Coating on selected surface areas, e.g. using masks
042using masks
C23C 16/042
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
16Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
04Coating on selected surface areas, e.g. using masks
042using masks
H01L 51/56
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED]
56Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
Applicants
  • 武汉华星光电半导体显示技术有限公司 WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. [CN]/[CN]
Inventors
  • 杜骁 DU, Xiao
Agents
  • 深圳翼盛智成知识产权事务所(普通合伙) ESSEN PATENT&TRADEMARK AGENCY
Priority Data
201811415668.726.11.2018CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) MASK FOR THIN FILM PACKAGING OF FLEXIBLE OLED PANEL
(FR) MASQUE POUR ENCAPSULATION DE FILM MINCE D'UN PANNEAU À OLED FLEXIBLE
(ZH) 一种用于柔性 OLED 面板薄膜封装的掩模版
Abstract
(EN)
Disclosed is a mask for the thin film packaging of a flexible OLED panel, the mask comprising a mask frame (20) and a mask body (10) arranged inside the mask frame (20). A shielding area (11) and an opening area (12) are defined in the mask body (10), wherein the opening area (12) corresponds to an AA area of the flexible OLED panel. A precise mask area (14) is further defined in the opening area (12), and corresponds to a bending area of the flexible OLED panel. Mutually separated precise openings (140) are defined in the precise mask area (14), and the size of each of the precise openings (140) corresponds to one or more pixel points. The mask for the thin film packaging of the flexible OLED panel can be used to manufacture a modular packaging layer (132), so that the inner stress of an inorganic thin film at a position during bending is reduced, and therefore, the risk of damaging the packaging layer during repeated bending of the bending area is reduced.
(FR)
L'invention concerne un masque pour encapsulation de film mince d'un panneau à OLED flexible, le masque comprenant un cadre de masque (20) et un corps de masque (10) disposé à l'intérieur du cadre de masque (20). Une zone de blindage (11) et une zone d'ouverture (12) sont définies dans le corps de masque (10), la zone d'ouverture (12) correspondant à une zone AA du panneau à OLED flexible. Une zone de masque précise (14) est en outre définie dans la zone d'ouverture (12), et correspond à une zone de courbure du panneau à OLED flexible. Des ouvertures précises mutuellement séparées (140) sont définies dans la zone de masque précise (14), et la taille de chacune des ouvertures précises (140) correspond à un ou plusieurs points de pixel. Le masque pour l'encapsulation de film mince du panneau à OLED flexible peut être utilisé pour fabriquer une couche d'encapsulation modulaire (132), de telle sorte que la contrainte interne d'un film mince inorganique au niveau d'une position pendant le pliage est réduite, et par conséquent, le risque d'endommagement de la couche d'encapsulation pendant une flexion répétée de la zone de courbure est réduit.
(ZH)
一种用于柔性OLED面板薄膜封装的掩模版,包括掩模版框架(20)和设置在所述掩模板框架(20)内的掩模版本体(10)。其中所述掩模版本体(10)内定义有遮蔽区(11)和开口区(12),其中所述开口区(12)对应于柔性OLED面板的AA区。所述开口区(12)内还定义有精密掩模板区(14),其对应于所述柔性OLED面板的弯折区。其中所述精密掩模板区(14)定义有相互分隔的精密开口(140),所述精密开口(140)的大小对应于一个或以上数量的像素点。一种用于柔性OLED面板薄膜封装的掩模版,其能够制作出模块化封装层(132),从而减小该处无机薄膜在弯曲时的内部应力,进而降低所述弯折区在反复弯折时发生封装层损坏的风险。
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