Processing

Please wait...

Settings

Settings

Goto Application

1. WO2020107599 - THERMALLY-CONDUCTIVE SHIELDING ORGANOSILICON MATERIAL AND PREPARATION METHOD THEREFOR

Publication Number WO/2020/107599
Publication Date 04.06.2020
International Application No. PCT/CN2018/123398
International Filing Date 25.12.2018
IPC
C08L 83/07 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
83Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Compositions of derivatives of such polymers
04Polysiloxanes
07containing silicon bound to unsaturated aliphatic groups
C08L 83/05 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
83Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Compositions of derivatives of such polymers
04Polysiloxanes
05containing silicon bound to hydrogen
C08K 13/02 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
13Use of mixtures of ingredients not covered by any single one of main groups C08K3/-C08K11/128
02Organic and inorganic ingredients
CPC
C08L 2205/025
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
2205Polymer mixtures characterised by other features
02containing two or more polymers of the same C08L -group
025containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
C08L 83/04
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
83Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
04Polysiloxanes
Applicants
  • 深圳先进技术研究院 SHENZHEN INSTITUTES OF ADVANCED TECHNOLOGY [CN]/[CN]
Inventors
  • 张保坦 ZHANG, Bao Tan
  • 孙蓉 SUN, Rong
  • 朱朋莉 ZHU, Peng Li
Agents
  • 北京市诚辉律师事务所 BEIJING CHENGHUI LAW FIRM
Priority Data
201811443493.029.11.2018CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) THERMALLY-CONDUCTIVE SHIELDING ORGANOSILICON MATERIAL AND PREPARATION METHOD THEREFOR
(FR) MATÉRIAU DE PROTECTION THERMOCONDUCTEUR À BASE D'ORGANOSILICIUM ET PROCÉDÉ DE PRÉPARATION S'Y RAPPORTANT
(ZH) 一种导热屏蔽有机硅材料及其制备方法
Abstract
(EN)
A thermally-conductive shielding organosilicon material and a preparation method therefor. Specifically disclosed is a thermally-conductive shielding organosilicon composite film material. The thermally-conductive shielding organosilicon composite film material comprises a thermally-conductive flexible material; the thermally-conductive flexible material comprises a graphite film core material and/or a graphene film core material; the graphite film or graphene film core material is a wave-shaped or corrugation-shaped graphite film or graphene film, and the graphite film or graphene film is parallel to the extension direction of the composite film material; preferably, the thermally-conductive flexible material is a liquid silicone rubber; more preferably, the liquid silicone rubber is prepared from poly(vinylsiloxane), a crosslinking agent, a catalyst, an inhibitor, and a surface treatment agent. In the present invention, the preparation method is simple, the materials are easy to obtain, and excellent thermally-conductive and shielding effects are obtained.
(FR)
L'invention concerne un matériau de protection thermoconducteur à base d'organosilicium et un procédé de préparation s'y rapportant. L'invention concerne plus précisément un matériau de protection thermoconducteur sous forme de film composite à base d'organosilicium. Le matériau de protection thermoconducteur sous forme de film composite à base d'organosilicium comprend un matériau flexible thermoconducteur ; le matériau flexible thermoconducteur comprend un matériau d'âme sous forme de film de graphite et/ou un matériau d'âme sous forme de film de graphène ; le matériau d'âme sous forme de film de graphite ou de film de graphène est un film de graphite ou un film de graphène de forme ondulée ou de forme cannelée et le film de graphite ou le film de graphène est parallèle à la direction d'extension du matériau sous forme de film composite ; de préférence, le matériau flexible thermoconducteur est un caoutchouc de silicone liquide ; de préférence encore, le caoutchouc de silicone liquide est préparé à partir de poly(vinylsiloxane), d'un agent de réticulation, d'un catalyseur, d'un inhibiteur et d'un agent de traitement de surface. Selon la présente invention, le procédé de préparation est simple, les matériaux sont faciles à obtenir et d'excellents effets thermoconducteurs et de protection sont obtenus.
(ZH)
一种导热屏蔽有机硅材料及其制备方法,具体公开了一种导热屏蔽的有机硅复合膜材料,其中包含了导热柔性材料,在导热柔性材料中具有石墨膜芯材和/或石墨烯膜芯材,其特征在于,石墨膜或石墨烯膜芯材为呈波浪状或瓦楞状的石墨膜或石墨烯膜,且石墨膜或石墨烯膜与复合膜材料的延展方向平行;优选地,所述导热柔性材料为液体硅橡胶;更优选地,所述的液体硅橡胶由聚乙烯基硅氧烷、交联剂、催化剂、抑制剂和表面处理剂制成。本发明的方法制备方法简单,材料容易获得,同时取得了优异的导热和屏蔽效果。
Also published as
Latest bibliographic data on file with the International Bureau