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1. WO2020107559 - LED WICK, ASSEMBLING METHOD THEREFOR, AND LED FILAMENT LAMP

Publication Number WO/2020/107559
Publication Date 04.06.2020
International Application No. PCT/CN2018/121844
International Filing Date 18.12.2018
IPC
F21K 9/20 2016.01
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21LIGHTING
KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
9Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes or lasers
20Light sources comprising attachment means
CPC
F21K 9/20
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21LIGHTING
KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
9Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
20Light sources comprising attachment means
F21V 19/00
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21LIGHTING
VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
19Fastening of light sources or lamp holders
Applicants
  • 广明源光科技股份有限公司 GMY LIGHTING TECHNOLOGY CO., LTD. [CN]/[CN]
Inventors
  • 李立胜 LI, Lisheng
  • 洪燕南 HONG, Yannan
  • 葛浩 GE, Hao
  • 赵胜霖 ZHAO, Shenglin
  • 张伟坚 ZHANG, Weijian
Agents
  • 北京超凡志成知识产权代理事务所(普通合伙) CHOFN INTELLECTUAL PROPERTY
Priority Data
201822006609.630.11.2018CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) LED WICK, ASSEMBLING METHOD THEREFOR, AND LED FILAMENT LAMP
(FR) MÈCHE À DEL, SON PROCÉDÉ D'ASSEMBLAGE ET LAMPE À FILAMENT À DEL
(ZH) LED灯芯及其组装方法、LED灯丝灯
Abstract
(EN)
An LED wick (100), an assembling method therefor, and an LED filament lamp (200). The LED wick (100) comprises a base (110), a support frame (120) provided on the base (110), and an LED flexible filament (130) wound around the support frame (120). The support frame (120) comprises a fixing plate (121). A plurality of recesses (122) are disposed at an edge of the fixing plate (121). A side wall of the LED flexible filament (130) is fixed in the plurality of recesses (122). The assembling method is used to assemble the LED wick (100). The LED filament lamp (200) comprises a light-transmitting housing (210) and the LED wick (100). The base (110) of the LED wick (100) penetrates and is disposed at an end of the housing (210). The structure of the LED wick (100) can reduce manufacturing difficulty and improve product yields.
(FR)
L'invention concerne une mèche à DEL (100), son procédé d'assemblage, et une lampe à filament à DEL (200). La mèche à DEL (100) comprend une base (110), un cadre de support (120) disposé sur la base (110), et un filament flexible à DEL (130) enroulé autour du cadre de support (120). Le cadre de support (120) comprend une plaque de fixation (121). Une pluralité de cavités (122) sont disposées au niveau d'un bord de la plaque de fixation (121). Une paroi latérale du filament flexible à DEL (130) est fixée dans la pluralité de cavités (122). Le procédé d'assemblage est utilisé pour assembler la mèche à DEL (100). La lampe à filament à DEL (200) comprend un boîtier de transmission de lumière (210) et la mèche à DEL (100). La base (110) de la mèche à DEL (100) pénètre et est disposée à une extrémité du boîtier (210). La structure de la mèche à DEL (100) peut réduire la difficulté de fabrication et améliorer les rendements des produits.
(ZH)
一种LED灯芯(100)及其组装方法、LED灯丝灯(200)。LED灯芯(100)包括:基座(110)、设置在基座(110)上的支架(120)以及绕设于支架(120)上的LED柔性灯丝(130),支架(120)包括固定板(121),固定板(121)的边缘凹设有多个凹部(122),LED柔性灯丝(130)的侧壁固定于多个凹部(122)内;组装方法用于组装LED灯芯(100);LED灯丝灯(200)包括透光外壳(210)和LED灯芯(100),LED灯芯(100)的基座(110)穿透设置在外壳(210)的一端。LED灯芯(100)的结构能够降低制作工艺难度,提高合格率。
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Latest bibliographic data on file with the International Bureau