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1. WO2020107506 - EB CURING-SPECIFIC PACKAGING ADHESIVE, PREPARATION METHOD, AND METHOD FOR PACKAGING FILM CAPACITOR

Publication Number WO/2020/107506
Publication Date 04.06.2020
International Application No. PCT/CN2018/119297
International Filing Date 05.12.2018
IPC
C09J 7/00 2018.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
7Adhesives in the form of films or foils
C09J 163/00 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
163Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
CPC
C08L 2203/206
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
2203Applications
20use in electrical or conductive gadgets
206use in coating or encapsulating of electronic parts
C08L 2205/02
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
2205Polymer mixtures characterised by other features
02containing two or more polymers of the same C08L -group
C08L 2205/035
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
2205Polymer mixtures characterised by other features
03containing three or more polymers in a blend
035containing four or more polymers in a blend
C09J 11/08
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
11Features of adhesives not provided for in group C09J9/00, e.g. additives
08Macromolecular additives
C09J 183/04
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
183Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
04Polysiloxanes
H01G 4/224
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
4Fixed capacitors; Processes of their manufacture
002Details
224Housing; Encapsulation
Applicants
  • 中广核达胜加速器技术有限公司 CGN DASHENG ELECTRON ACCELERATOR TECHNOLOGY CO., LTD [CN]/[CN]
Inventors
  • 陈川红 CHEN, Chuanhong
  • 罗洪文 LUO, Hongwen
  • 江华 JIANG, Hua
  • 潘启志 PAN, Qizhi
  • 朱焕铮 ZHU, Huanzheng
  • 季左 JI, Zuo
  • 封玉龙 FENG, Yulong
Agents
  • 苏州威世朋知识产权代理事务所(普通合伙) SUZHOU WISPRO INTELLECTUAL PROPERTY AGENCY
Priority Data
201811455545.630.11.2018CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) EB CURING-SPECIFIC PACKAGING ADHESIVE, PREPARATION METHOD, AND METHOD FOR PACKAGING FILM CAPACITOR
(FR) ADHÉSIF D'EMBALLAGE SPÉCIFIQUE DURCISSANT PAR FAISCEAU D'ÉLECTRONS, PROCÉDÉ DE PRÉPARATION ET PROCÉDÉ DE CONDITIONNEMENT D'UN CONDENSATEUR À FILM
(ZH) EB固化专用封装胶、制备方法及封装薄膜电容器的方法
Abstract
(EN)
The present invention relates to an EB curing-specific packaging adhesive, a preparation method, and a method for packaging a film capacitor. S1, hexanediol diacrylate, tripropylene glycol diacrylate, trimethylolpropane triacrylate, and diphenyl trimethylbenzoyl phosphine oxide are mixed; S2, high-functionality polyurethane acrylate and an aliphatic polyester material are added for mixing; S3, silsesquioxane is added for mixing; S4, a photoinitiator, hydroxycyclohexyl ketone, a modified dilute acid ester polymer defoamer, and a fluorine modified polysiloxane polymer are added for mixing to obtain an EB curing-specific packaging adhesive. The specific packaging adhesive is used for manufacturing a film capacitor. The specific packaging adhesive used has a solid content of 99% or more, and can reduce the VOCs emissions in a production workshop; UV pre-curing and EB deep curing are used in combination to improve the degree of cross-linking, thereby increasing the electricity storage capacity; no additional heating is needed, thereby reducing energy consumption; the curing speed is increased, the production efficiency is improved, and the occupied area is reduced.
(FR)
La présente invention concerne un adhésif d'emballage spécifique durcissant par faisceau d'électrons, un procédé de préparation et un procédé d'emballage d'un condensateur à film. S1, mélange de diacrylate d'hexanediol, de diacrylate de tripropylène glycol, de triacrylate de triméthylolpropane et d'oxyde de diphényl triméthylbenzoyl phosphine ; S2, ajout d'un acrylate de polyuréthane à haute fonctionnalité et d'un matériau de polyester aliphatique pour le mélange ; S3, ajout d'un silsesquioxane pour le mélange ; S4, ajout d'un photoinitiateur, d'une hydroxycyclohexyl cétone, d'un antimousse polymère d'ester d'acide dilué modifié, et d'un polymère de polysiloxane modifié au fluor pour le mélange pour obtenir un adhésif d'emballage spécifique au durcissement par faisceau d'électrons. L'adhésif d'emballage spécifique est utilisé pour fabriquer un condensateur à film. L'adhésif d'emballage spécifique utilisé a une teneur en solides supérieure ou égale à 99 %, et peut réduire les émissions de COV dans un atelier de production ; le pré-durcissement par UV et le durcissement en profondeur par faisceau d'électrons sont utilisés en combinaison pour améliorer le degré de réticulation, ce qui permet d'augmenter la capacité de stockage d'électricité ; aucun chauffage supplémentaire n'est nécessaire, ce qui réduit la consommation d'énergie ; la vitesse de durcissement est augmentée, l'efficacité de production est améliorée, et la zone occupée est réduite.
(ZH)
本发明涉及一种EB固化专用封装胶、制备方法及封装薄膜电容器的方法,S1、将已二醇二丙稀酸酯、二缩三丙二醇二丙稀酸酯、三羟甲基丙烷三丙稀酸酯以及三甲基苯甲酰基二苯基氧化膦混合;S2、加入高官聚氨酯丙稀酸酯以及脂肪族聚酯型材料混合;S3、加入倍半硅氧烷混合;S4、加入光引发剂、羟基环已基甲酮、改性稀酸酯类聚合物消泡剂、氟改性聚硅氧烷聚合物混合,得到EB固化专用封装胶;并通过该专用封装胶对薄膜电容器进行制作。采用的专用封装胶其含固率可达99%以上,减少生产车间VOCs的排放;采用UV预固化与EB深度固化相结合,提高交联度,增加储电量,无需额外加热,降低能耗,固化速度增加,提高生产效率,减少占地面积。
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