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1. WO2020107399 - CHIP-ON-FILM MODULE, DISPLAY PANEL AND DISPLAY DEVICE

Publication Number WO/2020/107399
Publication Date 04.06.2020
International Application No. PCT/CN2018/118540
International Filing Date 30.11.2018
IPC
H01L 23/498 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
488consisting of soldered or bonded constructions
498Leads on insulating substrates
H05K 1/02 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
CPC
H01L 23/498
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements
488consisting of soldered ; or bonded; constructions
498Leads, ; i.e. metallisations or lead-frames; on insulating substrates, ; e.g. chip carriers
H05K 1/02
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
Applicants
  • 深圳市柔宇科技有限公司 SHENZHEN ROYOLE TECHNOLOGIES CO., LTD. [CN]/[CN]
Inventors
  • 许小杰 XU, Xiaojie
Agents
  • 深圳市六加知识产权代理有限公司 LIUJIA CHINA IP LAW OFFICE
Priority Data
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) CHIP-ON-FILM MODULE, DISPLAY PANEL AND DISPLAY DEVICE
(FR) MODULE DE FILM SUR PUCE, PANNEAU D'AFFICHAGE ET DISPOSITIF D'AFFICHAGE
(ZH) 覆晶薄膜模组、显示面板及显示装置
Abstract
(EN)
A chip-on-film structure (100), a display panel (60) and a display device (200). The chip-on-film structure (100) comprises a flexible substrate (10) and a chip (20). The flexible substrate (10) comprises a stress relief structure (12). The chip (20) comprises connecting terminals (22). The connecting terminals (22) fixedly connect the chip (20) to the flexible substrate (10). The stress relief structure (12) and the connecting terminals (22) are spaced from each other by a preset distance, so that the stress relief structure (12) can reduce the stress experienced by the connecting terminals (22) when the flexible substrate (10) is bent and can prevent the chip (20) from de-soldering in the bent state, improving the reliability of the chip-on-film structure (100) in the bent state.
(FR)
La présente invention concerne une structure de film sur puce (100), un panneau d’affichage (60) et un dispositif d’affichage (200). La structure de film sur puce (100) comprend un substrat flexible (10) et une puce (20). Le substrat flexible (10) comprend une structure de relaxation de contrainte (12). La puce (20) comprend des bornes de connexion (22). Les bornes de connexion (22) relient de manière fixe la puce (20) au substrat flexible (10). La structure de relaxation de contrainte (12) et les bornes de connexion (22) sont espacées les unes des autres d'une distance prédéfinie, de telle sorte que la structure de relaxation de contrainte (12) peut réduire la contrainte subie par les bornes de connexion (22) lorsque le substrat flexible (10) est plié et peut empêcher la puce (20) de se désouder dans l'état plié, améliorant la fiabilité de la structure de puce sur film (100) dans l'état plié.
(ZH)
一种覆晶薄膜结构(100)、显示面板(60)及显示装置(200),其中覆晶薄膜结构(100)包括柔性基板(10)和芯片(20),柔性基板(10)包括消应力结构(12),芯片(20)包括连接端子(22),连接端子(22)将芯片(20)固定连接于柔性基板(10)上,消应力结构(12)与连接端子(22)间隔预设距离,以使柔性基板(10)弯曲时,消应力结构(12)可减小连接端子(22)受到的应力,可防止芯片(20)在弯折状态下脱焊,提高覆晶薄膜结构(100)在弯折状态下的可靠性。
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