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1. WO2020107316 - IMAGE SENSOR, METHOD FOR PREPARING IMAGE SENSOR, AND PIXEL CIRCUIT

Publication Number WO/2020/107316
Publication Date 04.06.2020
International Application No. PCT/CN2018/118152
International Filing Date 29.11.2018
IPC
H01L 27/146 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
14including semiconductor components sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
144Devices controlled by radiation
146Imager structures
CPC
H01L 27/146
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
14including semiconductor components sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
144Devices controlled by radiation
146Imager structures
Applicants
  • 深圳市大疆创新科技有限公司 SZ DJI TECHNOLOGY CO., LTD. [CN]/[CN]
Inventors
  • 徐泽 XU, Ze
Agents
  • 北京龙双利达知识产权代理有限公司 LONGSUN LEAD IP LTD.
Priority Data
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) IMAGE SENSOR, METHOD FOR PREPARING IMAGE SENSOR, AND PIXEL CIRCUIT
(FR) CAPTEUR D'IMAGE, PROCÉDÉ DE PRÉPARATION DE CAPTEUR D'IMAGE ET CIRCUIT DE PIXEL
(ZH) 图像传感器、制备图像传感器的方法和像素电路
Abstract
(EN)
An image sensor (200), a method for preparing the image sensor (200), and a pixel circuit. The image sensor (200) comprises multiple pixel units (210), a circuit of each pixel unit (210) is provided on multiple wafers (221, 222), and the circuit of each pixel unit (210) is electrically connected between the multiple wafers (221, 222).
(FR)
L'invention concerne un capteur d'image (200), un procédé de préparation du capteur d'image (200) et un circuit de pixel. Le capteur d'image (200) comprend de multiples unités de pixel (210), un circuit de chaque unité de pixel (210) est disposé sur de multiples tranches (221, 222), et le circuit de chaque unité de pixel (210) est électriquement connecté entre les multiples tranches (221, 222).
(ZH)
一种图像传感器(200)、制备图像传感器(200)的方法和像素电路。该图像传感器(200)包括:多个像素单元(210);其中,每个像素单元(210)的电路设置于多片晶圆(221,222)上,每个像素单元(210)的电路在所述多片晶圆(221,222)之间电连接。
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