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1. WO2020099699 - USE OF HCL IN DRY ELECTROLYTES TO POLISH TI AND OTHER METAL AND ALLOY SURFACES BY ION TRANSPORT

Publication Number WO/2020/099699
Publication Date 22.05.2020
International Application No. PCT/ES2019/070751
International Filing Date 06.11.2019
IPC
C25F 3/16 2006.1
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
FPROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
3Electrolytic etching or polishing
16Polishing
CPC
B22F 10/28
BPERFORMING OPERATIONS; TRANSPORTING
22CASTING; POWDER METALLURGY
FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER
10Additive manufacturing of workpieces or articles from metallic powder
20Direct sintering or melting
28Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM]
B22F 10/62
BPERFORMING OPERATIONS; TRANSPORTING
22CASTING; POWDER METALLURGY
FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER
10Additive manufacturing of workpieces or articles from metallic powder
60Treatment of workpieces or articles after build-up
62by chemical means
B22F 2999/00
BPERFORMING OPERATIONS; TRANSPORTING
22CASTING; POWDER METALLURGY
FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER
2999Aspects linked to processes or compositions used in powder metallurgy
B23H 5/08
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
HWORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
5Combined machining
06Electrochemical machining combined with mechanical working, e.g. grinding or honing
08Electrolytic grinding
B33Y 40/20
BPERFORMING OPERATIONS; TRANSPORTING
33ADDITIVE MANUFACTURING TECHNOLOGY
YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
40Auxiliary operations or equipment, e.g. for material handling
20Post-treatment, e.g. curing, coating or polishing
C09G 1/02
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
GPOLISHING COMPOSITIONS
1Polishing compositions
02containing abrasives or grinding agents
Applicants
  • DRYLYTE, S.L. [ES]/[ES]
Inventors
  • SARSANEDAS MILLET, Pau
Agents
  • ESPIELL VOLART, Eduardo Mª
Priority Data
P20183109312.11.2018ES
Publication Language Spanish (es)
Filing Language Spanish (ES)
Designated States
Title
(EN) USE OF HCL IN DRY ELECTROLYTES TO POLISH TI AND OTHER METAL AND ALLOY SURFACES BY ION TRANSPORT
(ES) USO DE UN HCI EN ELECTROLITOS SECOS PARA PULIR Ti Y OTRAS SUPERFICIES DE METALES Y ALEACIONES A TRAVÉS DE TRANSPORTE IÓNICO
(FR) UTILISATION D'UN HCL DANS DES ÉLECTROLYTES SECS POUR POLIR TI ET D'AUTRES SURFACES DE MÉTAUX ET D'ALLIAGES PAR LE BIAIS DU TRANSPORT IONIQUE
Abstract
(EN) Use of dry electrolytes to polish Ti and other metal and alloy surfaces by ion transport characterised in that the conducting liquid in the dry electrolyte comprises HCl. The concentration of HCl with respect to solvent is preferably between 1% and 38%, and more preferably between 5% and 15%. A dry electrolyte characterised by comprising hydrochloric acid as conducting liquid according to any of the previous claims.
(ES) Uso de electrolitos secos para pulir Ti y otras superficies de metales y aleaciones a través de transporte iónico caracterizado porque el líquido conductor del electrólito seco comprende HCl. Preferentemente la concentración de HCl en relación con el disolvente está entre el 1 y el 38 % y más preferentemente está entre el 5 y el 15 %. Electrólito seco caracterizado porque comprende ácido clorhídrico como líquido conductor de acuerdo con cualquiera de las reivindicaciones anteriores.
(FR) L'invention concerne l'utilisation d'électrolytes secs pour polir Ti et d'autres surfaces de métaux et d'alliages par le biais du transport ionique, ladite utilisation étant caractérisée en ce que le liquide conducteur de l'électrolyte sec comprend HCl. De préférence, la concentration de HCl par rapport au dissolvant se situe entre 1 et 38% et, idéalement entre 5 et 15%. L'électrolyte sec est caractérisé en ce qu'il comprend de l'acide chlorhydrique en tant que liquide conducteur selon n'importe quelle des revendications antérieures.
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