Processing

Please wait...

Settings

Settings

Goto Application

1. WO2020096731 - SIGNAL RECOGNITION DURING SUBSTRATE PATTERNING VIA DIGITAL PHOTOLITHOGRAPHY

Publication Number WO/2020/096731
Publication Date 14.05.2020
International Application No. PCT/US2019/055865
International Filing Date 11.10.2019
IPC
G03F 7/20 2006.01
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
20Exposure; Apparatus therefor
G03F 1/76 2012.01
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
1Originals for photomechanical production of textured or patterned surfaces, e.g. masks, photo-masks or reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
68Preparation processes not covered by groups G03F1/20-G03F1/5096
76Patterning of masks by imaging
H01L 21/027 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
027Making masks on semiconductor bodies for further photolithographic processing, not provided for in group H01L21/18 or H01L21/34165
CPC
G03F 7/20
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
20Exposure; Apparatus therefor
G03F 7/70641
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
70Exposure apparatus for microlithography
70483Information management, control, testing, and wafer monitoring, e.g. pattern monitoring
70616Wafer pattern monitoring, i.e. measuring printed patterns or the aerial image at the wafer plane
70641Focus
Applicants
  • APPLIED MATERIALS, INC. [US]/[US]
Inventors
  • SALLAK, Rashid M.
Agents
  • DOUGHERTY, Chad M.
  • VER STEEG, Steven H.
Priority Data
62/757,58108.11.2018US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) SIGNAL RECOGNITION DURING SUBSTRATE PATTERNING VIA DIGITAL PHOTOLITHOGRAPHY
(FR) RECONNAISSANCE DE SIGNAL PENDANT LA FORMATION DE MOTIFS DE SUBSTRAT PAR PHOTOLITHOGRAPHIE NUMÉRIQUE
Abstract
(EN)
Embodiments of the present disclosure are related to systems and methods for autofocusing an imaging apparatus in real-time during substrate scanning to pattern a substrate that includes a photoresist formed over one or more patterned materials. Displays of varying sizes can be fabricated using digital photolithography systems. The digital photolithography systems discussed herein, which may be referred to as imaging systems, use one or more exposure sources, including solid state emitter devices, for operations including patterning photoresists. Signal classifiers are used to perform shape and pattern recognition to determine whether signals received during substrate scanning are from a top photoresist surface or from sub-surface layers. One or more parameters of the imaging apparatus can be adjusted or maintained based on the signal analysis.
(FR)
Des modes de réalisation de la présente invention concernent des systèmes et des procédés d'autofocalisation d'un appareil d'imagerie en temps réel pendant un balayage de substrat pour former un motif sur un substrat qui comprend une photorésine formée sur un ou plusieurs matériaux à motifs. Des affichages de tailles variables peuvent être fabriqués à l'aide de systèmes de photolithographie numérique. Les systèmes de photolithographie numérique décrits ici, qui peuvent être appelés systèmes d'imagerie, utilisent une ou plusieurs sources d'exposition, comprenant des dispositifs émetteurs à semi-conducteurs, pour des opérations comprenant la formation de motifs de photorésines. Des classificateurs de signal sont utilisés pour effectuer une reconnaissance de forme et de motif afin de déterminer si des signaux reçus pendant le balayage de substrat proviennent d'une surface de photorésine supérieure ou de couches de sous-surface. Un ou plusieurs paramètres de l'appareil d'imagerie peuvent être ajustés ou maintenus sur la base de l'analyse de signal.
Latest bibliographic data on file with the International Bureau