Processing

Please wait...

Settings

Settings

Goto Application

1. WO2020096579 - COVERS FOR ELECTRONIC DEVICES

Publication Number WO/2020/096579
Publication Date 14.05.2020
International Application No. PCT/US2018/059464
International Filing Date 06.11.2018
IPC
C23C 4/04 2006.01
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
4Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
04characterised by the coating material
Applicants
  • HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. [US]/[US]
Inventors
  • WU, Kuan-Ting
  • CHANG, Chi Hao
  • LIN, Chien-Ting
Agents
  • COSTALES, Shruti
  • OAKESON, Gary P.
Priority Data
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) COVERS FOR ELECTRONIC DEVICES
(FR) COUVERCLES DESTINÉS À DES DISPOSITIFS ÉLECTRONIQUES
Abstract
(EN)
The present disclosure is drawn to covers for electronic devices. In one example, a cover for an electronic device can include a light metal substrate and a dried sol-gel oxide coating on a first surface of the light metal substrate. The light metal substrate can have a density from about 0.5 g/cm3 to about 7.5 g/cm3. The light metal substrate can also include a micro-arc oxidation layer across a second surface of the light metal substrate. The first surface of the light metal substrate may not include a micro-arc oxidation layer.
(FR)
La présente invention concerne des couvercles destinés à des dispositifs électroniques. Dans un exemple, un couvercle destiné à un dispositif électronique peut comprendre un substrat métallique léger et un revêtement d'oxyde sol-gel séché sur une première surface du substrat métallique léger. Le substrat métallique léger peut avoir une densité d'environ 0,5 g/cm3 à environ 7,5 g/cm3. Le substrat métallique léger peut également comprendre une couche d'oxydation micro-arc sur une seconde surface du substrat métallique léger. La première surface du substrat métallique léger peut ne pas comprendre une couche d'oxydation micro-arc.
Latest bibliographic data on file with the International Bureau