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1. WO2020096383 - DISPLAY DEVICE

Publication Number WO/2020/096383
Publication Date 14.05.2020
International Application No. PCT/KR2019/015087
International Filing Date 07.11.2019
IPC
H01L 27/15 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
15including semiconductor components with at least one potential-jump barrier or surface barrier, specially adapted for light emission
G09F 9/30 2006.01
GPHYSICS
09EDUCATING; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
9Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
30in which the desired character or characters are formed by combining individual elements
H01L 33/58 2010.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
58Optical field-shaping elements
H01L 33/20 2010.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
02characterised by the semiconductor bodies
20with a particular shape, e.g. curved or truncated substrate
CPC
H01L 2224/32145
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
31Structure, shape, material or disposition of the layer connectors after the connecting process
32of an individual layer connector
321Disposition
32135the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
32145the bodies being stacked
H01L 24/32
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
24Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
31Structure, shape, material or disposition of the layer connectors after the connecting process
32of an individual layer connector
H01L 25/0753
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; ; Multistep manufacturing processes thereof
03all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes
04the devices not having separate containers
075the devices being of a type provided for in group H01L33/00
0753the devices being arranged next to each other
H01L 25/0756
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; ; Multistep manufacturing processes thereof
03all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes
04the devices not having separate containers
075the devices being of a type provided for in group H01L33/00
0756Stacked arrangements of devices
H01L 2924/12041
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
10Details of semiconductor or other solid state devices to be connected
11Device type
12Passive devices, e.g. 2 terminal devices
1204Optical Diode
12041LED
Applicants
  • 서울바이오시스 주식회사 SEOUL VIOSYS CO., LTD. [KR]/[KR]
Inventors
  • 이정훈 LEE, Chung Hoon
Agents
  • 이기성 LEE, Ki Sung
Priority Data
16/674,01605.11.2019US
62/756,89407.11.2018US
Publication Language Korean (KO)
Filing Language Korean (KO)
Designated States
Title
(EN) DISPLAY DEVICE
(FR) DISPOSITIF D'AFFICHAGE
(KO) 표시 장치
Abstract
(EN)
A display device is provided. The display device comprises: a flexible substrate; a plurality of light emitting diodes arranged on the substrate and spaced apart from each other; and a light shielding layer filled between the light emitting diodes and partially covering each of the light emitting diodes to define individual light emission surfaces, wherein the distances between the light emission surfaces are equal to each other.
(FR)
La présente invention concerne un dispositif d'affichage. Le dispositif d'affichage comprend : un substrat souple ; une pluralité de diodes électroluminescentes disposées sur le substrat et espacées les unes des autres ; et une couche de protection contre la lumière remplie entre les diodes électroluminescentes et recouvrant partiellement chacune des diodes électroluminescentes pour définir des surfaces d'émission de lumière individuelles, les distances entre les surfaces d'émission de lumière étant égales les unes aux autres.
(KO)
표시 장치를 제공한다. 표시 장치는, 유연성 기판, 기판 상에서 서로 이격된 복수의 발광 소자들, 및 발광 소자들 사이를 채우며, 발광 소자들 각각의 일부를 덮어 광 추출면들을 각각 정의하는 광 차단막을 포함하되, 광 추출면들 사이 거리가 서로 동일하다.
Also published as
Latest bibliographic data on file with the International Bureau