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1. WO2020095902 - THERMALLY CONDUCTIVE COMPOSITION, THERMALLY CONDUCTIVE MEMBER, METHOD FOR PRODUCING THERMALLY CONDUCTIVE MEMBER, HEAT DISSIPATION STRUCTURE, HEAT GENERATING COMPOSITE MEMBER, AND HEAT DISSIPATING COMPOSITE MEMBER

Publication Number WO/2020/095902
Publication Date 14.05.2020
International Application No. PCT/JP2019/043310
International Filing Date 05.11.2019
IPC
C08L 101/12 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
101Compositions of unspecified macromolecular compounds
12characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
C09K 5/14 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
KMATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
5Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
08Materials not undergoing a change of physical state when used
14Solid materials, e.g. powdery or granular
H05K 7/20 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
Applicants
  • 積水ポリマテック株式会社 SEKISUI POLYMATECH CO., LTD. [JP]/[JP]
Inventors
  • 石田 慶太 ISHIDA, Keita
  • 北田 学 KITADA, Gaku
Agents
  • 田口 昌浩 TAGUCHI, Masahiro
  • 虎山 滋郎 TORAYAMA, Jiro
Priority Data
2018-21130009.11.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) THERMALLY CONDUCTIVE COMPOSITION, THERMALLY CONDUCTIVE MEMBER, METHOD FOR PRODUCING THERMALLY CONDUCTIVE MEMBER, HEAT DISSIPATION STRUCTURE, HEAT GENERATING COMPOSITE MEMBER, AND HEAT DISSIPATING COMPOSITE MEMBER
(FR) COMPOSITION THERMOCONDUCTRICE, ÉLÉMENT THERMOCONDUCTEUR, PROCÉDÉ DE PRODUCTION D’UN ÉLÉMENT THERMOCONDUCTEUR, STRUCTURE DE DISSIPATION THERMIQUE, ÉLÉMENT COMPOSITE DE GÉNÉRATION DE CHALEUR, ET ÉLÉMENT COMPOSITE DE DISSIPATION DE CHALEUR
(JA) 熱伝導性組成物、熱伝導性部材、熱伝導性部材の製造方法、放熱構造、発熱複合部材、放熱複合部材
Abstract
(EN)
The present invention provides a thermally conductive composition which is capable of forming a thick film with good productivity. A thermally conductive composition which contains a binder and a thermally conductive filler, and which is configured such that: a first viscosity as measured by a rotational viscometer at a rotation rate of 10 rpm at 25°C is 50-300 Pa·s; and if a second viscosity is measured by a rotational viscometer at a rotation rate of 1 rpm at 25°C, the ratio of the second viscosity to the first viscosity, namely (second viscosity)/(first viscosity) is 3-8.
(FR)
La présente invention fournit une composition thermoconductrice qui est capable de former un film épais avec une bonne productivité. Une composition thermoconductrice qui contient un liant et une charge thermoconductrice, et qui est configurée de sorte que : une première viscosité telle que mesurée par un viscosimètre rotatif à une vitesse de rotation de 10 tr/min à 25 °C soit de 50 à 300 Pa·s ; et si une seconde viscosité est mesurée par un viscosimètre rotatif à une vitesse de rotation de 1 tr/min à 25 °C, le rapport de la seconde viscosité à la première viscosité, à savoir (seconde viscosité)/(première viscosité) soit compris entre 3 et 8.
(JA)
良好な生産性で厚膜形成が可能な熱伝導性組成物を提供する。 バインダーと熱伝導性充填材とを含む熱伝導性組成物であって、25℃において回転粘度計を用いて回転速度10rpmで測定される第1粘度が、50~300Pa・sであり、25℃において回転粘度計を用いて回転速度1rpmで測定される粘度を第2粘度としたときに、第1粘度に対する第2粘度の比率[第2粘度/第1粘度]が、3~8である熱伝導性組成物である。
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