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1. WO2020095892 - FLUX, METHOD FOR APPLYING FLUX, AND METHOD FOR MOUNTING SOLDER BALL

Publication Number WO/2020/095892
Publication Date 14.05.2020
International Application No. PCT/JP2019/043279
International Filing Date 05.11.2019
IPC
B23K 35/363 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
35Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
22characterised by the composition or nature of the material
36Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
362Selection of compositions of fluxes
363for soldering or brazing
H05K 3/34 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
30Assembling printed circuits with electric components, e.g. with resistor
32electrically connecting electric components or wires to printed circuits
34by soldering
B23K 35/26 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
35Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
22characterised by the composition or nature of the material
24Selection of soldering or welding materials proper
26with the principal constituent melting at less than 400°C
C22C 13/00 2006.01
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
CALLOYS
13Alloys based on tin
Applicants
  • 千住金属工業株式会社 SENJU METAL INDUSTRY CO., LTD. [JP]/[JP]
Inventors
  • 西▲崎▼ 貴洋 NISHIZAKI Takahiro
  • 福山 直晃 FUKUYAMA Naoaki
  • 川▲崎▼ 浩由 KAWASAKI Hiroyoshi
Agents
  • 特許業務法人山口国際特許事務所 YAMAGUCHI INTERNATIONAL PATENT FIRM
Priority Data
2018-20865706.11.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) FLUX, METHOD FOR APPLYING FLUX, AND METHOD FOR MOUNTING SOLDER BALL
(FR) FLUX, PROCÉDÉ POUR APPLIQUER UN FLUX ET PROCÉDÉ DE FIXATION D'UNE BILLE DE SOUDURE
(JA) フラックス、フラックスの塗布方法及びはんだボールの搭載方法
Abstract
(EN)
Provided is flux that can be discharged using an inkjet method and that is capable of bonding to an adherend after application. This flux includes 5-50 mass% of a solid solvent having a melting point of 60°C or less, 50-80 mass% of a solvent, 5-10 mass% of an organic acid, 10-30 mass% of an amine, and 0-5 mass% of a halide, the flux forming a liquid having a high viscosity of 5 Pa·s or higher at 25°C, and forming a liquid having a low viscosity of 50 mPa·s or less at 100°C.
(FR)
L'invention concerne un flux, qui peut être déchargé à l'aide d'un procédé à jet d'encre, et qui est apte à se lier à un support après application. Ce flux comprend de 5 à 50% en masse d'un solvant solide ayant un point de fusion de 60° C ou moins, de 50 à 80% en masse d'un solvant, de 5 à 10% en masse d'un acide organique, de 10 à 30% en masse d'une amine, et de 0 à 5% en masse d'un halogénure, le flux formant un liquide ayant une viscosité élevée, de 5 Pa.s ou plus, à 25° C, et formant un liquide ayant une faible viscosité, de 50 mPa·s ou moins, à 100° C.
(JA)
インクジェット法での吐出が可能で、かつ、塗布後に対象物の固着が可能なフラックスを提供する。 フラックスは、融点が60℃以下の固形溶剤を5質量%以上50質量%以下、溶剤を50質量%以上80質量%以下、有機酸を5質量%以上10質量%以下、アミンを10質量%以上30質量%以下、ハロゲン化物を0質量%以上5質量%以下で含み、25℃で5Pa・s以上の高粘度の液体となり、100℃で50mPa・s以下の低粘度の液体となる。
Also published as
Latest bibliographic data on file with the International Bureau