Processing

Please wait...

Settings

Settings

Goto Application

1. WO2020095813 - CERAMIC ELECTRONIC COMPONENT

Publication Number WO/2020/095813
Publication Date 14.05.2020
International Application No. PCT/JP2019/042775
International Filing Date 31.10.2019
IPC
H05K 3/28 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
22Secondary treatment of printed circuits
28Applying non-metallic protective coatings
H01G 4/228 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
4Fixed capacitors; Processes of their manufacture
002Details
228Terminals
H01G 4/30 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
4Fixed capacitors; Processes of their manufacture
30Stacked capacitors
H05K 1/16 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
16incorporating printed electric components, e.g. printed resistor, capacitor, inductor
H05K 3/46 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
46Manufacturing multi-layer circuits
Applicants
  • 株式会社村田製作所 MURATA MANUFACTURING CO., LTD. [JP]/[JP]
Inventors
  • 村北 直哉 MURAKITA, Naoya
  • 大坪 喜人 OTSUBO, Yoshihito
  • 山元 一生 YAMAMOTO, Issei
  • 森本 裕太 MORIMOTO, Yuta
Agents
  • 特許業務法人 安富国際特許事務所 YASUTOMI & ASSOCIATES
Priority Data
2018-21086808.11.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) CERAMIC ELECTRONIC COMPONENT
(FR) COMPOSANT ÉLECTRONIQUE EN CÉRAMIQUE
(JA) セラミック電子部品
Abstract
(EN)
This ceramic electronic component is provided with: a component body including a ceramic layer; at least one terminal electrode disposed on one main surface of the component body; and an insulating coating layer disposed across the ceramic layer and the terminal electrode so as to cover not all but a part of the periphery of the terminal electrode. When viewed in plan from the one main surface of the component body, the coating layer intersects the terminal electrode at a non-vertical angle in an intersecting portion in which the terminal electrode not covered with the coating layer intersects the coating layer.
(FR)
Ce composant électronique en céramique est pourvu d'un corps de composant comprenant une couche de céramique ; d'au moins une électrode de borne disposée sur une surface principale du corps de composant ; et d'une couche de revêtement isolant disposée à travers la couche de céramique et la borne de l'électrode de manière à recouvrir, non en totalité mais seulement une partie de la périphérie de la borne de l'électrode. Lorsqu'elle est vue en plan à partir de la surface principale du corps de composant, la couche de revêtement coupe la borne de l'électrode à un angle non vertical dans une partie d'intersection dans laquelle la borne de l'électrode non recouverte par la couche de revêtement croise la couche de revêtement.
(JA)
本発明のセラミック電子部品は、セラミック層を含む部品本体と、上記部品本体の一方主面に設けられた少なくとも1つの端子電極と、上記端子電極の周縁部の全周ではなく一部を覆うように、上記セラミック層及び上記端子電極に跨って設けられた絶縁性の被覆層とを備え、上記部品本体の一方主面から平面視したとき、上記被覆層で覆われていない上記端子電極と上記被覆層とが交わる交差部分において、上記被覆層は、上記端子電極と垂直でない角度で交わっている。
Latest bibliographic data on file with the International Bureau