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1. WO2020095789 - COPOLYMER, AND RESIN COMPOSITION CONTAINING SAID COPOLYMER

Publication Number WO/2020/095789
Publication Date 14.05.2020
International Application No. PCT/JP2019/042553
International Filing Date 30.10.2019
IPC
C08F 220/22 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
220Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide, or nitrile thereof
02Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
10Esters
22Esters containing halogen
G03F 7/004 2006.01
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
G03F 7/027 2006.01
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
G03F 7/031 2006.01
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
028with photosensitivity-increasing substances, e.g. photoinitiators
031Organic compounds not covered by group G03F7/02967
G02B 5/20 2006.01
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
5Optical elements other than lenses
20Filters
H05K 3/28 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
22Secondary treatment of printed circuits
28Applying non-metallic protective coatings
Applicants
  • 昭和電工株式会社 SHOWA DENKO K.K. [JP]/[JP]
Inventors
  • 青木 優介 AOKI Yusuke
  • 川口 恭章 KAWAGUCHI Yasuaki
Agents
  • 及川 周 OIKAWA Shu
  • 荒 則彦 ARA Norihiko
  • 勝俣 智夫 KATSUMATA Tomoo
Priority Data
2018-21079008.11.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) COPOLYMER, AND RESIN COMPOSITION CONTAINING SAID COPOLYMER
(FR) COPOLYMÈRE, ET COMPOSITION DE RÉSINE CONTENANT CE COPOLYMÈRE
(JA) 共重合体、およびその共重合体を含む樹脂組成物
Abstract
(EN)
Provided is an acrylic resin having thermosetting properties and having a superior low-refractive index. This copolymer (A) is characterized by having an acid value of 20 KOHmg/g or more and including: at least one structural unit selected from the group consisting of structural units derived from polymerizable monomers (a-1A) having a bridged cyclic hydrocarbon group having 10-20 carbon atoms and structural units derived from polymerizable monomers (a-1B) represented by chemical formula (1); a structural unit derived from a fluorine-containing (meth)acrylate (a-2) represented by chemical formula (2); a structural unit derived from an epoxy group-containing (meth)acrylate (a-3); a structural unit derived from an unsaturated carboxylic acid (a-4); and a structural unit derived from a hydroxy group-containing (meth)acrylate (a-6).
(FR)
L'invention fournit une résine acrylique qui exprime un photodurcissement, et qui simultanément présente une excellente faiblesse d'indice de réfraction. Le copolymère (A) de l'invention est caractéristique en ce qu'il contient : au moins une sorte d'unité structurale choisie dans un groupe constitué d'une unité structurale dérivée d'un monomère polymérisable (a-1A) ayant un groupe hydrocarbure cyclique ponté en C10 à C20, et d'une unité structurale dérivée d'un monomère polymérisable (a-1B) représenté par la formule chimique (1); une unité structurale dérivée d'un (méth)acrylate (a-2) comprenant un fluor représenté par la formule chimique (2); une unité structurale dérivée d'un (méth)acrylate (a-3) comprenant un groupe époxy; une unité structurale dérivée d'un acide carboxylique insaturé (a-4); et une unité structurale dérivée d'un (méth)acrylate (a-6) comprenant un groupe hydroxy. En outre, le copolymère (A) de l'invention est caractéristique en ce que son indice d'acide est supérieur ou égal à 20KOHmg/g.
(JA)
熱硬化性を発現しながら、優れた低屈折率を有するアクリル系樹脂を提供する。本発明の共重合体(A)は、炭素数10~20の橋かけ環式炭化水素基を有する重合性モノマー(a-1A)由来の構成単位および下記化学式(1)で示される重合性モノマー(a-1B)由来の構成単位からなる群から選択される少なくとも1種と、下記化学式(2)で示されるフッ素含有(メタ)アクリレート(a-2)由来の構成単位と、エポキシ基含有(メタ)アクリレート(a-3)由来の構成単位と不飽和カルボン酸(a-4)由来の構成単位と、ヒドロキシ基含有(メタ)アクリレート(a-6)由来の構成単位とを含有し、酸価が20KOHmg/g以上であることを特徴とする。
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