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1. WO2020095763 - COMPOSITION FOR LOW DIELECTRIC HEAT CONDUCTIVE MATERIAL AND LOW DIELECTRIC HEAT CONDUCTIVE MATERIAL

Publication Number WO/2020/095763
Publication Date 14.05.2020
International Application No. PCT/JP2019/042383
International Filing Date 29.10.2019
IPC
H01L 23/373 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
373Cooling facilitated by selection of materials for the device
C08K 3/22 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3Use of inorganic substances as compounding ingredients
18Oxygen-containing compounds, e.g. metal carbonyls
20Oxides; Hydroxides
22of metals
C08L 33/04 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
33Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Compositions of derivatives of such polymers
04Homopolymers or copolymers of esters
H01L 33/48 2010.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
H05K 7/20 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
Applicants
  • 北川工業株式会社 KITAGAWA INDUSTRIES CO., LTD. [JP]/[JP]
Inventors
  • 李 健広 LI Jianguang
  • 齋藤 政宏 SAITO Masahiro
  • 祐岡 輝明 YUOKA Teruaki
Agents
  • 特許業務法人暁合同特許事務所 AKATSUKI UNION PATENT FIRM
Priority Data
2018-21060308.11.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) COMPOSITION FOR LOW DIELECTRIC HEAT CONDUCTIVE MATERIAL AND LOW DIELECTRIC HEAT CONDUCTIVE MATERIAL
(FR) COMPOSITION POUR MATÉRIAU CONDUCTEUR DE CHALEUR À FAIBLE CONSTANTE DIÉLECTRIQUE ET MATÉRIAU CONDUCTEUR DE CHALEUR À FAIBLE CONSTANTE DIÉLECTRIQUE
(JA) 低誘電熱伝導材用組成物、及び低誘電熱伝導材
Abstract
(EN)
The purpose of the present invention is to provide a novel low dielectric heat conductive material, etc. that do not use a hollow filler. This composition for a low dielectric heat conductive material comprises: an acrylic resin composition that includes one or more (meth)acrylates and an acrylic polymer formed by polymerizing one or more (meth)acrylates; crystalline silica that has an average particle size of 20 μm or more; a metalhydroxide that has an average particle size of 15 μm or less; a polyfunctional monomer; and a polymerization initiator. The crystalline silica, metalhydroxide, polyfunctional monomer, and polymerization initiator are blended, respectively, in amounts of 330 to 440 parts by mass, 90 to 190 parts by mass, 0.01 to 0.5 parts by mass, and 0.6 to 1.3 parts by mass relative to 100 parts by mass of the acrylic resin composition.
(FR)
Le but de la présente invention est de fournir un nouveau matériau conducteur de chaleur à faible constante diélectrique, etc, qui n'utilise pas de charge creuse. Cette composition pour matériau conducteur de chaleur à faible constante diélectrique comprend : une composition de résine acrylique qui comprend un ou plusieurs (méth) acrylates et un polymère acrylique formé par polymérisation d'un ou plusieurs (méth) acrylates; la silice cristalline qui a une taille moyenne de particule supérieure ou égale à 20 µm; un hydroxyde métallique qui a une taille moyenne de particule inférieure ou égale à 15 µm; un monomère polyfonctionnel; et un initiateur de polymérisation. La silice cristalline, l'hydroxyde métallique, le monomère polyfonctionnel et l'initiateur de polymérisation sont mélangés, respectivement, dans des quantités de 330 à 440 parties en masse, de 90 à 190 parties en masse, 0,01 à 0,5 parties en masse, et 0,6 à 1,3 parties en masse par rapport à 100 parties en masse de la composition de résine acrylique.
(JA)
中空フィラーを使用しない新しい低誘電熱伝導材等の提供。 【解決手段】本発明の低誘電熱伝導材用組成物は、1種又は2種以上の(メタ)アクリレートを重合してなるアクリル系重合体、並びに1種又は2種以上の(メタ)アクリレートを含むアクリル樹脂組成物と、平均粒径が20μm以上の結晶性シリカと、平均粒径が15μm以下の金属水酸化物と、多官能モノマーと、重合開始剤とを有し、前記アクリル樹脂組成物100質量部に対して、前記結晶性シリカが330質量部以上440質量部以下、前記金属水酸化物が90質量部以上190質量部以下、前記多官能モノマーが0.01質量部以上0.5質量部以下、前記重合開始剤が0.6質量部以上1.3質量部以下の割合でそれぞれ配合されている。
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