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1. WO2020095582 - PROCESSING CUP UNIT AND SUBSTRATE PROCESSING DEVICE

Publication Number WO/2020/095582
Publication Date 14.05.2020
International Application No. PCT/JP2019/038971
International Filing Date 02.10.2019
IPC
H01L 21/304 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18the devices having semiconductor bodies comprising elements of group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
304Mechanical treatment, e.g. grinding, polishing, cutting
B05C 11/08 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
05SPRAYING OR ATOMISING IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
CAPPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
11Component parts, details or accessories not specifically provided for in groups B05C1/-B05C9/132
02Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface; Control of the thickness of a coating
08Spreading liquid or other fluent material by manipulating the work, e.g. tilting
H01L 21/027 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
027Making masks on semiconductor bodies for further photolithographic processing, not provided for in group H01L21/18 or H01L21/34165
Applicants
  • 株式会社SCREENホールディングス SCREEN HOLDINGS CO., LTD. [JP]/[JP]
Inventors
  • 杉山 念 SUGIYAMA, Minoru
Agents
  • 中川 雅博 NAKAGAWA, Masahiro
  • 福島 祥人 FUKUSHIMA, Yoshito
  • 澤村 英幸 SAWAMURA, Hideyuki
Priority Data
2018-21009807.11.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) PROCESSING CUP UNIT AND SUBSTRATE PROCESSING DEVICE
(FR) UNITÉ DE COUPELLE DE TRAITEMENT ET DISPOSITIF DE TRAITEMENT DE SUBSTRAT
(JA) 処理カップユニットおよび基板処理装置
Abstract
(EN)
This processing cup unit is disposed so as to surround a substrate being held in a horizontal position when the substrate is subjected to a process using a processing liquid. The processing cup unit is provided with a lower cup, an upper cup, and a mist attachment-preventing member. The upper cup is disposed so as to surround the substrate. The lower cup is located under the upper cup. The mist attachment-preventing member is disposed under the substrate. The mist attachment-preventing member prevents a mist of the processing liquid from attaching to the underside of the substrate.
(FR)
L'invention concerne une unité de coupelle de traitement qui est disposée de manière à entourer un substrat qui est maintenu dans une position horizontale lorsque le substrat est soumis à un traitement à l'aide d'un liquide de traitement. L'unité de coupelle de traitement comporte une coupelle inférieure, une coupelle supérieure et un élément de prévention de fixation de brume. La coupelle supérieure est disposée de manière à entourer le substrat. La coupelle inférieure est située sous la coupelle supérieure. L'élément de prévention de fixation de brume est disposé sous le substrat. L'élément de prévention de fixation de brume empêche un brouillard du liquide de traitement de se fixer à la face inférieure du substrat.
(JA)
処理カップユニットは、水平姿勢で保持される基板に処理液を用いた処理を行う際に、基板の周囲を取り囲むように設けられる。処理カップユニットは、下カップと、上カップと、ミスト付着防止部材とを備える。上カップは、基板の周囲を取り囲むように配置される。下カップは、上カップの下方に位置する。ミスト付着防止部材は、基板の下方に配置される。ミスト付着防止部材は、基板の下面に処理液のミストが付着することを防止する。
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