Processing

Please wait...

Settings

Settings

Goto Application

1. WO2020095340 - CIRCUIT FORMING METHOD

Publication Number WO/2020/095340
Publication Date 14.05.2020
International Application No. PCT/JP2018/040950
International Filing Date 05.11.2018
IPC
H05K 3/12 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
10in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
12using printing techniques to apply the conductive material
H05K 3/00 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
H05K 3/10 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
10in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
H05K 3/32 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
30Assembling printed circuits with electric components, e.g. with resistor
32electrically connecting electric components or wires to printed circuits
Applicants
  • 株式会社FUJI FUJI CORPORATION [JP]/[JP]
Inventors
  • 塚田 謙磁 TSUKADA, Kenji
Agents
  • 特許業務法人ネクスト NEXT INTERNATIONAL
  • 片岡 友希 KATAOKA, Tomoki
Priority Data
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) CIRCUIT FORMING METHOD
(FR) PROCÉDÉ DE FORMATION DE CIRCUIT
(JA) 回路形成方法
Abstract
(EN)
This circuit forming method includes: an application step in which a metal containing liquid that contains metal fine particles, and a metal paste that contains a resin binder and metal particles larger than the metal fine particles are applied so as to overlap on a base; and a heating step in which the metal containing liquid and the metal paste which were applied in the application step are heated so as to become conductive.
(FR)
Procédé de formation de circuit comprenant une étape d'application dans laquelle un liquide contenant un métal qui contient des particules fines métalliques, et une pâte métallique qui contient un liant de résine et des particules métalliques plus grosses que les particules fines métalliques sont appliqués de manière à se chevaucher sur une base ; et une étape de chauffage dans laquelle le liquide contenant du métal et la pâte métallique qui ont été appliqués dans l'étape d'application sont chauffés de manière à devenir conducteur.
(JA)
金属微粒子を含有する金属含有液と、金属微粒子より大きな金属粒子と樹脂バインダーとを含有する金属ペーストとをベース上に重なるように塗布する塗布工程と、塗布工程において塗布された金属含有液と金属ペーストとを加熱することで導電化させる加熱工程とを含む回路形成方法。
Latest bibliographic data on file with the International Bureau