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1. WO2020094477 - PRINTED CIRCUIT BOARD SYSTEM, STORED ELECTRICAL ENERGY SOURCE, AND METHOD FOR PRODUCING A PRINTED CIRCUIT BOARD SYSTEM

Publication Number WO/2020/094477
Publication Date 14.05.2020
International Application No. PCT/EP2019/079652
International Filing Date 30.10.2019
IPC
H05K 3/32 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
30Assembling printed circuits with electric components, e.g. with resistor
32electrically connecting electric components or wires to printed circuits
H05K 3/36 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
36Assembling printed circuits with other printed circuits
H05K 3/40 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
40Forming printed elements for providing electric connections to or between printed circuits
CPC
H05K 2203/107
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2203Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
10Using electric, magnetic and electromagnetic fields; Using laser light
107Using laser light
H05K 3/328
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
30Assembling printed circuits with electric components, e.g. with resistor
32electrically connecting electric components or wires to printed circuits
328by welding
H05K 3/361
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
36Assembling printed circuits with other printed circuits
361Assembling flexible printed circuits with other printed circuits
H05K 3/4084
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
40Forming printed elements for providing electric connections to or between printed circuits
4038Through-connections; Vertical interconnect access [VIA] connections
4084by deforming at least one of the conductive layers
Applicants
  • ROBERT BOSCH GMBH [DE]/[DE]
Inventors
  • BORMANN, Axel
  • OECHSLE, Matthias
  • DITTERT, Thomas
  • PROELL, Johannes
  • METZLER, Sebastian
Priority Data
10 2018 219 037.208.11.2018DE
Publication Language German (DE)
Filing Language German (DE)
Designated States
Title
(DE) LEITERPLATTENSYSTEM, ELEKTRISCHER ENERGIESPEICHER UND VERFAHREN ZUM HERSTELLEN EINES LEITERPLATTENSYSTEMS
(EN) PRINTED CIRCUIT BOARD SYSTEM, STORED ELECTRICAL ENERGY SOURCE, AND METHOD FOR PRODUCING A PRINTED CIRCUIT BOARD SYSTEM
(FR) SYSTÈME DE CARTE DE CIRCUITS IMPRIMÉS, ACCUMULATEUR D'ÉNERGIE ÉLECTRIQUE ET PROCÉDÉ DE FABRICATION D'UN SYSTÈME DE CARTE DE CIRCUITS IMPRIMÉS
Abstract
(DE)
Leiterplattensystem (1) aufweisend eine Leiterplatte (8) und einen Flachleiter (9), wobei die Leiterplatte (8) eine Kontaktfläche (3) aufweist, wobei der Flachleiter (9) eine Deckfolie, eine Basisfolie (4) und eine zwischengeordnete Leiterfolie (5) aufweist, wobei die Leiterfolie (5) einen Verbindungsbereich (7) aufweist, der in einer Ausnehmung (6) der Deckfolie und der Basisfolie (4) angeordnet ist, wobei die Kontaktfläche (3) und der Verbindungsbereich (7) stoffschlüssig miteinander verbunden sind.
(EN)
The invention relates to a printed circuit board system (1) having a printed circuit board (8) and a flat conductor (9), wherein: the printed circuit board (8) has a contact area (3); the flat conductor (9) has a coverlay film, a base film (4), and a conductor film (5) therebetween; the conductor film (5) has a connection region (7) which is situated in a cut-out (6) in the coverlay film and the base film (4); the contact area (3) and the connection region (7) being integrally joined to each other.
(FR)
L'invention concerne un système (1) de carte de circuits imprimés, comportant une carte de circuits imprimés (8) et un conducteur plat (9), la carte de circuits imprimés (8) comportant une surface de contact (3), le conducteur plat (9) comportant une feuille de recouvrement, une feuille de base (4) et une feuille conductrice (5) située entre celles-ci, la feuille conductrice (5) comportant une zone de liaison (7), qui est disposée dans un évidement (6) de la feuille de recouvrement et de la feuille de base (4), la surface de contact (3) et la zone de liaison (7) étant reliées l'une à l'autre par liaison de matières.
Latest bibliographic data on file with the International Bureau