Processing

Please wait...

Settings

Settings

Goto Application

1. WO2020093909 - DRIVE SUBSTRATE MANUFACTURING METHOD, DRIVE SUBSTRATE, DISPLAY PANEL AND DISPLAY DEVICE

Publication Number WO/2020/093909
Publication Date 14.05.2020
International Application No. PCT/CN2019/114087
International Filing Date 29.10.2019
IPC
H01L 21/67 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 27/15 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
15including semiconductor components with at least one potential-jump barrier or surface barrier, specially adapted for light emission
CPC
H01L 21/67144
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67011Apparatus for manufacture or treatment
67144Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
H01L 27/156
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
15including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
153in a repetitive configuration, e.g. LED bars
156two-dimensional arrays
Applicants
  • 京东方科技集团股份有限公司 BOE TECHNOLOGY GROUP CO., LTD. [CN]/[CN]
  • 成都京东方光电科技有限公司 CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD. [CN]/[CN]
Inventors
  • 张振华 ZHANG, Zhenhua
  • 徐映嵩 XU, Yingsong
  • 代伟男 DAI, Weinan
  • 汪杨鹏 WANG, Yangpeng
Agents
  • 北京律智知识产权代理有限公司 BEIJING INTELLEGAL INTELLECTUAL PROPERTY AGENT LTD.
Priority Data
201811334368.609.11.2018CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) DRIVE SUBSTRATE MANUFACTURING METHOD, DRIVE SUBSTRATE, DISPLAY PANEL AND DISPLAY DEVICE
(FR) PROCÉDÉ DE FABRICATION DE SUBSTRAT D'ENTRAÎNEMENT, SUBSTRAT D'ENTRAÎNEMENT, PANNEAU D’AFFICHAGE ET DISPOSITIF D’AFFICHAGE
(ZH) 驱动基板的制作方法、驱动基板、显示面板及显示装置
Abstract
(EN)
Provided are a drive substrate manufacturing method, a drive substrate, a display panel and a display device. The drive substrate manufacturing method comprises: providing a first chip array located on a wafer substrate, wherein the first chip array comprises chips in array arrangement at first intervals; providing a transfer head array arranged on an extendable substrate, wherein the transfer head array comprises transfer heads in array arrangement at second intervals; using the transfer head array before extending to pick up a second chip array from the wafer substrate, wherein chips of the second chip array are in array arrangement at third intervals; extending the extendable substrate such that the chips of the second chip array are arranged in array at fourth intervals; and releasing a target chip of the second chip array to a chip bonding position of the drive substrate, by means of the transfer head array after extending.
(FR)
La présente invention concerne un procédé de fabrication de substrat d'entraînement, un substrat d'entraînement, un panneau d'affichage et un dispositif d'affichage. Le procédé de fabrication de substrat d'entraînement consiste à : utiliser un premier réseau de puces situé sur un substrat de tranche, le premier réseau de puces comprenant des puces selon une disposition de réseau à des premiers intervalles ; utiliser un réseau de têtes de transfert disposé sur un substrat extensible, le réseau de têtes de transfert comprenant des têtes de transfert selon une disposition de réseau à des deuxièmes intervalles ; utiliser le réseau de têtes de transfert avant extension pour saisir un second réseau de puces à partir du substrat de tranche, les puces du second réseau de puces étant disposées en réseau à des troisièmes intervalles ; étendre le substrat extensible de sorte que les puces du second réseau de puces soient disposées en réseau à des quatrièmes intervalles ; et libérer une puce cible du second réseau de puces à une position de liaison de puce du substrat d'entraînement, au moyen du réseau de têtes de transfert après extension.
(ZH)
一种驱动基板的制作方法、驱动基板、显示面板及显示装置。驱动基板的制作方法包括:提供位于晶圆衬底上的第一芯片阵列,第一芯片阵列包括以第一间距阵列排布的芯片;提供设置于可伸缩衬底上的转移头阵列,转移头阵列包括以第二间距阵列排布的转移头;利用伸缩前的转移头阵列从晶圆衬底上拾取第二芯片阵列,第二芯片阵列中的芯片以第三间距阵列排布;伸缩可伸缩衬底,以使第二芯片阵列中的芯片以第四间距阵列排布;通过伸缩后的转移头阵列,将第二芯片阵列中的目标芯片释放至驱动基板的芯片键合位置。
Also published as
Latest bibliographic data on file with the International Bureau