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1. WO2020093898 - SOLVENT BASED CONDUCTIVE PASTE FOR 3D PRINTING

Publication Number WO/2020/093898
Publication Date 14.05.2020
International Application No. PCT/CN2019/113676
International Filing Date 28.10.2019
IPC
H01B 1/22 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
20Conductive material dispersed in non-conductive organic material
22the conductive material comprising metals or alloys
H01B 1/20 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
20Conductive material dispersed in non-conductive organic material
H01B 13/00 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
13Apparatus or processes specially adapted for manufacturing conductors or cables
C08K 3/08 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3Use of inorganic substances as compounding ingredients
02Elements
08Metals
Applicants
  • NANO AND ADVANCED MATERIALS INSTITUTE LIMITED [CN]/[CN]
Inventors
  • WANG, Yuechen
  • FU, Li
Agents
  • IDEA INTELLECTUAL (SHENZHEN) IP AGENCY
Priority Data
62/757,16408.11.2018US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) SOLVENT BASED CONDUCTIVE PASTE FOR 3D PRINTING
(FR) PÂTE CONDUCTRICE À BASE DE SOLVANT POUR IMPRESSION 3D
Abstract
(EN)
A thixotropic, solvent-based conductive paste capable of 3D printing by a micro-dispensing nozzle is provided. The conductive paste includes approximately 50 weight percent to approximately 80 weight percent conductive flakes having a ratio of the largest flake dimension to the smallest flake dimension (aspect ratio) of at least approximately 50. The paste includes a resin in an amount of less than approximately 20 weight percent, a solvent in an amount of less than approximately 40 weight percent, a surfactant in an amount of less than approximately 5 weight percent and a thixotropic agent in an amount of less than approximately 5 weight percent. The conductive paste has a viscosity of approximately 10,000 to 100,000 centipoise, a curing temperature of approximately 90℃ to approximately 120℃. The sheet resistance of a cured film formed from the conductive paste is approximately 10 micro-ohms to approximately 50 micro-ohms per square.
(FR)
L'invention concerne une pâte conductrice thixotropique à base de solvant capable d'impression 3D par une buse de micro-distribution. La pâte conductrice comprend approximativement 50 pour cent en poids à environ 80 pour cent en poids de paillettes conductrices ayant un rapport de la plus grande dimension de paillette à la plus petite dimension de paillette (rapport d'aspect) d'au moins environ 50. La pâte comprend une résine en une quantité inférieure à environ 20 pour cent en poids, un solvant dans une quantité inférieure à environ 40 pour cent en poids, un tensioactif en une quantité inférieure à environ 5 pour cent en poids et un agent thixotropique en une quantité inférieure à environ 5 pour cent en poids. La pâte conductrice présente une viscosité d'environ 10 000 à 100 000 centipoises, une température de durcissement d'environ 90 °C à environ 120 °C. La résistance de couche d'un film durci formé à partir de la pâte conductrice est d'environ 10 micro-ohms à environ 50 micro-ohms par carré.
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