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1. WO2020093258 - THERMALLY CONDUCTIVE COMPOSITION AND METHODS AND DEVICES IN WHICH SAID COMPOSITION IS USED

Publication Number WO/2020/093258
Publication Date 14.05.2020
International Application No. PCT/CN2018/114267
International Filing Date 07.11.2018
IPC
C08L 83/04 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
83Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Compositions of derivatives of such polymers
04Polysiloxanes
C08K 3/38 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3Use of inorganic substances as compounding ingredients
38Boron-containing compounds
C08K 3/28 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3Use of inorganic substances as compounding ingredients
28Nitrogen-containing compounds
C08K 7/00 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
7Use of ingredients characterised by shape
H01L 23/36 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
H05K 7/20 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
Applicants
  • DOW GLOBAL TECHNOLOGIES LLC [US]/[US]
  • DOW SILICONES CORPORATION [US]/[US]
  • HU, Xiaolian [CN]/[CN] (SC)
  • ZHANG, Jiguang [CA]/[CN] (SC)
  • ZHENG, Yan [CN]/[CN] (SC)
  • CHEN, Hongyu [US]/[CN] (SC)
  • CHEN, Chen [CN]/[CN] (SC)
  • BHAGWAGAR, Dorab [IN]/[US] (SC)
  • HANSEN, Darren [US]/[US] (SC)
Inventors
  • HU, Xiaolian
  • ZHANG, Jiguang
  • ZHENG, Yan
  • CHEN, Hongyu
  • CHEN, Chen
  • BHAGWAGAR, Dorab
  • HANSEN, Darren
Agents
  • SHANGHAI PATENT & TRADEMARK LAW OFFICE, LLC
Priority Data
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) THERMALLY CONDUCTIVE COMPOSITION AND METHODS AND DEVICES IN WHICH SAID COMPOSITION IS USED
(FR) COMPOSITION THERMOCONDUCTRICE ET PROCÉDÉS ET DISPOSITIFS DANS LESQUELS LADITE COMPOSITION EST UTILISÉE
Abstract
(EN)
A highly thermally conductive composition is provided, such composition comprising: (A) An organopolysiloxane composition; (B) a filler treating agent; (C) a thermal stabilizer; and (D) thermally conductive filler mixture, comprising: (D-1) a small-particulate thermally conductive filler having a mean size of up to 3 μm, (D-2) spherical aluminum nitride having a mean size of from 50 to 150 μm, (D-3) boron nitride having a mean size of from 20 to 200 μm.
(FR)
L'invention concerne une composition hautement thermoconductrice, ladite composition comprenant : (A) une composition d'organopolysiloxane; (B) un agent de traitement de charge; (C) un stabilisant thermique; et (D) un mélange de charge thermiquement conducteur, comprenant : (D-1) une charge thermoconductrice à petites particules ayant une taille moyenne allant jusqu'à 3 µm, (D-2) un nitrure d'aluminium sphérique ayant une taille moyenne de 50 à 150 µm, (D-3) du nitrure de bore ayant une taille moyenne de 20 à 200 µm.
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