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1. WO2020091514 - HEAT DISSIPATION STRUCTURE AND ELECTRONIC DEVICE INCLUDING SAME

Publication Number WO/2020/091514
Publication Date 07.05.2020
International Application No. PCT/KR2019/014730
International Filing Date 01.11.2019
IPC
H05K 7/20 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
H01L 23/427 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
42Fillings or auxiliary members in containers selected or arranged to facilitate heating or cooling
427Cooling by change of state, e.g. use of heat pipes
G06F 1/20 2006.01
GPHYSICS
06COMPUTING; CALCULATING OR COUNTING
FELECTRIC DIGITAL DATA PROCESSING
1Details not covered by groups G06F3/-G06F13/82
16Constructional details or arrangements
20Cooling means
Applicants
  • 삼성전자 주식회사 SAMSUNG ELECTRONICS CO., LTD. [KR]/[KR]
Inventors
  • 정혜인 CHUNG, Haein
  • 구경하 KOO, Kyungha
  • 배승재 BAE, Seungjae
  • 윤현중 YOON, Hyunjoong
  • 정재호 CHUNG, Jaeho
  • 조용원 CHO, Yongwon
Agents
  • 특허법인 태평양 BAE, KIM & LEE IP GROUP
Priority Data
10-2018-013293601.11.2018KR
Publication Language Korean (KO)
Filing Language Korean (KO)
Designated States
Title
(EN) HEAT DISSIPATION STRUCTURE AND ELECTRONIC DEVICE INCLUDING SAME
(FR) STRUCTURE DE DISSIPATION THERMIQUE ET DISPOSITIF ÉLECTRONIQUE COMPRENANT CETTE STRUCTURE
(KO) 방열 구조체 및 이를 포함하는 전자 장치
Abstract
(EN)
An embodiment of the present invention discloses a heat dissipation structure and an electronic device including the heat dissipation structure, the heat dissipation structure comprising: at least one heat dissipation plate; at least one rigid plate which forms an opening in one area and is coupled to the upper portion of the at least one heat dissipation plate to support durability of the at least one heat dissipation plate; at least one heat pipe of which at least a portion is accommodated in the opening formed by the at least one rigid plate and is coupled to an area of the at least one heat dissipation plate that faces the at least one heat pipe; and at least one fixing tool which supports the fixing between the at least one heat dissipation plate and the at least one rigid plate. In addition, various embodiments identified through the specification are possible.
(FR)
Un mode de réalisation de la présente invention concerne une structure de dissipation thermique et un dispositif électronique comprenant la structure de dissipation thermique, la structure de dissipation thermique comprenant au moins une plaque de dissipation thermique ; au moins une plaque rigide qui forme une ouverture dans une zone et est couplée à la partie supérieure d'au moins une plaque de dissipation thermique pour supporter la durabilité d'au moins une plaque de dissipation thermique ; au moins un caloduc dont au moins une partie est logée dans l'ouverture formée par au moins une plaque rigide et est couplée à une zone d'au moins une plaque de dissipation thermique qui fait face à au moins un caloduc ; et au moins un outil de fixation qui supporte la fixation entre au moins une plaque de dissipation thermique et au moins une plaque rigide. De plus, divers modes de réalisation identifiés dans la description sont possibles.
(KO)
본 발명의 일 실시 예는, 적어도 하나의 방열 플레이트, 일 영역으로 개구를 형성하고 상기 적어도 하나의 방열 플레이트의 상부로 접합되어 상기 적어도 하나의 방열 플레이트에 내구성을 지원하는 적어도 하나의 강성 플레이트, 적어도 일부가 상기 적어도 하나의 강성 플레이트에 의해 형성된 상기 개구에 수용되어 대면하는 상기 적어도 하나의 방열 플레이트의 일 영역과 접합되는 적어도 하나의 히트 파이프, 및 상기 적어도 하나의 방열 플레이트 및 상기 적어도 하나의 강성 플레이트 상호 간의 고정을 지원하는 적어도 하나의 고정 툴(tool)을 포함하는 방열 구조체와, 상기 방열 구조체를 포함하는 전자 장치를 개시한다. 이 외에도 명세서를 통하여 파악되는 다양한 실시 예가 가능하다.
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