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1. WO2020091413 - SUBSTRATE TREATMENT DEVICE

Publication Number WO/2020/091413
Publication Date 07.05.2020
International Application No. PCT/KR2019/014458
International Filing Date 30.10.2019
IPC
H01L 51/56 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
56Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
H01L 51/00 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
C23C 14/24 2006.01
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
22characterised by the process of coating
24Vacuum evaporation
H01L 21/68 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
68for positioning, orientation or alignment
H01L 21/67 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/687 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
683for supporting or gripping
687using mechanical means, e.g. chucks, clamps or pinches
Applicants
  • 어플라이드 머티어리얼스, 인코포레이티드 APPLIED MATERIALS, INC. [US]/[US]
Inventors
  • 조생현 CHO, Saeng Hyun
  • 안성일 AHN, Sung Il
Agents
  • 특허법인 남앤남 NAM & NAM
Priority Data
10-2018-013122330.10.2018KR
Publication Language Korean (KO)
Filing Language Korean (KO)
Designated States
Title
(EN) SUBSTRATE TREATMENT DEVICE
(FR) DISPOSITIF DE TRAITEMENT DE SUBSTRAT
(KO) 기판 처리 장치
Abstract
(EN)
Disclosed in the present embodiment is a substrate treatment device in which one surface of an alignment assembly for aligning a substrate and a mask is integrally formed with the body of a vacuum chamber. Therefore, provided is an alignment assembly including a plate integrally formed with a body for forming the external surface of a vacuum chamber, the alignment assembly, in comparison with a conventional assembly, reducing the work time for fine movement and alignment of a substrate and a mask, thereby improving production efficiency.
(FR)
Dans le présent mode de réalisation, l'invention porte sur un dispositif de traitement de substrat dans lequel une surface d'un ensemble d'alignement servant à aligner un substrat et un masque est formée d'un seul tenant avec le corps d'une chambre à vide. Par conséquent, l'invention concerne un ensemble d'alignement comprenant une plaque formée d'un seul tenant avec un corps destiné à former la surface externe d'une chambre à vide, l'ensemble d'alignement, par comparaison avec un ensemble classique, réduisant le temps de travail pour un mouvement fin et un alignement d'un substrat et d'un masque, ce qui permet d'améliorer le rendement de production.
(KO)
본 실시예는 기판 및 마스크를 정렬하는 정렬 어셈블리의 일 면과 진공챔버의 바디가 일체로 형성된 기판 처리 장치를 개시한다. 이에 종래와 비교하여 기판 및 마스크의 미세 이동 및 정렬을 위한 작업 시간을 줄여 생산 효율성이 향상될 수 있는 진공챔버의 외면을 형성하는 바디와 일체로 형성된 플레이트를 포함하는 정렬 어셈블리를 제공할 수 있게 된다.
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