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1. WO2020091146 - POLYIMIDE PRECURSOR COMPOSITION FOR IMPROVING ADHESION OF POLYIMIDE FILM AND POLYIMIDE FILM PREPARED THEREFROM

Publication Number WO/2020/091146
Publication Date 07.05.2020
International Application No. PCT/KR2019/000909
International Filing Date 22.01.2019
IPC
C08G 73/10 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
73Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen or carbon, not provided for in groups C08G12/-C08G71/238
06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule; Polyhydrazides; Polyamide acids or similar polyimide precursors
10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
C08L 79/08 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
79Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08L61/-C08L77/259
04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
C08K 5/521 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5Use of organic ingredients
49Phosphorus-containing compounds
51Phosphorus bound to oxygen
52bound to oxygen only
521Esters of phosphoric acids, e.g. of H3PO4
C08K 5/5415 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5Use of organic ingredients
54Silicon-containing compounds
541containing oxygen
5415containing at least one Si-O bond
C08L 83/04 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
83Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Compositions of derivatives of such polymers
04Polysiloxanes
C08L 83/12 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
83Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Compositions of derivatives of such polymers
10Block- or graft-copolymers containing polysiloxane sequences
12containing polyether sequences
CPC
C08G 73/1007
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
73Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
1003Preparatory processes
1007from tetracarboxylic acids or derivatives and diamines
C08J 5/18
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G
5Manufacture of articles or shaped materials containing macromolecular substances
18Manufacture of films or sheets
C08K 5/521
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
5Use of organic ingredients
49Phosphorus-containing compounds
51Phosphorus bound to oxygen
52Phosphorus bound to oxygen only
521Esters of phosphoric acids, e.g. of H3PO4
C08K 5/5415
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
5Use of organic ingredients
54Silicon-containing compounds
541containing oxygen
5415containing at least one Si—O bond
C08L 2203/16
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
2203Applications
16used for films
C08L 79/08
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
79Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
Applicants
  • 에스케이씨코오롱피아이 주식회사 SKCKOLONPI INC. [KR]/[KR]
Inventors
  • 황인환 HWANG, In Hwan
  • 이익상 LEE, Ik Sang
Agents
  • 특허법인 광장리앤고 LEE & KO IP
Priority Data
10-2018-013172731.10.2018KR
Publication Language Korean (KO)
Filing Language Korean (KO)
Designated States
Title
(EN) POLYIMIDE PRECURSOR COMPOSITION FOR IMPROVING ADHESION OF POLYIMIDE FILM AND POLYIMIDE FILM PREPARED THEREFROM
(FR) COMPOSITION DE PRÉCURSEUR DE POLYIMIDE POUR AMÉLIORER L'ADHÉRENCE D'UN FILM DE POLYIMIDE ET FILM DE POLYIMIDE PRÉPARÉ À PARTIR DE CELLE-CI
(KO) 폴리이미드 필름의 접착성을 향상시키기 위한 폴리이미드 전구체 조성물 및 이로부터 제조되는 폴리이미드 필름
Abstract
(EN)
The present invention provides a polyimide precursor composition comprising: a polyamic acid solution prepared by polymerizing one or more kinds of dianhydride monomer and at least one kind of diamine monomer in an organic solvent; an aromatic carboxylic acid having four or more carboxyl groups; and an antioxidant, wherein the dianhydride monomer includes an adhesive dianhydride monomer represented by chemical formula 1, and a polyimide film prepared therefrom has an elongation of 13% or more.
(FR)
La présente invention concerne une composition de précurseur de polyimide comprenant : une solution d'acide polyamique préparée par polymérisation d'un ou plusieurs types de monomère de dianhydride et d'au moins un type de monomère de diamine dans un solvant organique; un acide carboxylique aromatique ayant quatre groupes carboxyle ou plus; et un antioxydant, le monomère dianhydride comprenant un monomère de dianhydride adhésif représenté par la formule chimique 1, et un film de polyimide préparé à partir de celui-ci ayant un allongement de 13% ou plus.
(KO)
본 발명은 1종 이상의 디안하이드라이드 단량체와 1종 이상의 디아민 단량체가 유기 용매 중에서 중합되어 제조되는 폴리아믹산 용액; 4개 이상의 카르복실기를 갖는 방향족 카르복실산; 및 산화방지제를 포함하고, 상기 디안하이드라이드 단량체는, 화학식 1로 표현되는 접착성 디안하이드라이드 단량체를 포함하고, 이로부터 제조되는 폴리이미드 필름의 신율이 13 % 이상인, 폴리이미드 전구체 조성물을 제공한다.
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