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1. WO2020090909 - LASER MACHINING DEVICE

Publication Number WO/2020/090909
Publication Date 07.05.2020
International Application No. PCT/JP2019/042616
International Filing Date 30.10.2019
IPC
B23K 26/00 2014.01
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
B23K 26/53 2014.01
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
50Working by transmitting the laser beam through or within the workpiece
53for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
H01L 21/301 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18the devices having semiconductor bodies comprising elements of group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
301to subdivide a semiconductor body into separate parts, e.g. making partitions
Applicants
  • 浜松ホトニクス株式会社 HAMAMATSU PHOTONICS K.K. [JP]/[JP]
Inventors
  • 坂本 剛志 SAKAMOTO Takeshi
  • 奥間 惇治 OKUMA Junji
Agents
  • 長谷川 芳樹 HASEGAWA Yoshiki
  • 黒木 義樹 KUROKI Yoshiki
  • 柴山 健一 SHIBAYAMA Kenichi
Priority Data
2018-20411430.10.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) LASER MACHINING DEVICE
(FR) DISPOSITIF D'USINAGE AU LASER
(JA) レーザ加工装置
Abstract
(EN)
This laser machining device comprises: a support unit; a laser machining head; a vertical movement mechanism; a horizontal movement mechanism; and a control unit. The control unit executes peripheral edge processing for forming a modified region along the peripheral edge of an effective region on an object by controlling the start and stop of irradiation of laser light in a laser machining head on the basis of rotation information under conditions where, while the control unit rotates the support unit, the focus point is located at a position along the peripheral edge of the effective region on the object.
(FR)
Le dispositif d'usinage au laser selon l'invention comprend : une unité de support ; une tête d'usinage au laser ; un mécanisme de déplacement vertical ; un mécanisme de déplacement horizontal ; et une unité de commande. L'unité de commande exécute un traitement de bord périphérique permettant de former une région modifiée le long du bord périphérique d'une région efficace sur un objet en commandant le démarrage et l'arrêt d'une exposition à une lumière laser dans une tête d'usinage au laser sur la base d'informations de rotation dans des conditions où, tandis que l'unité de commande fait tourner l'unité de support, le point focal est situé à une position le long du bord périphérique de la région efficace sur l'objet.
(JA)
レーザ加工装置は、支持部と、レーザ加工ヘッドと、鉛直移動機構と、水平移動機構と、制御部と、を備える。制御部は、支持部を回転させながら、対象物における有効領域の周縁に沿った位置に集光点を位置させた状態で、回転情報に基づいてレーザ加工ヘッドにおけるレーザ光の照射の開始及び停止を制御することにより、対象物における有効領域の周縁に沿って改質領域を形成させる周縁処理を実行する。
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