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1. WO2020090902 - LASER MACHINING DEVICE AND LASER MACHINING METHOD

Publication Number WO/2020/090902
Publication Date 07.05.2020
International Application No. PCT/JP2019/042602
International Filing Date 30.10.2019
IPC
B23K 26/53 2014.01
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
50Working by transmitting the laser beam through or within the workpiece
53for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
H01L 21/301 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18the devices having semiconductor bodies comprising elements of group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
301to subdivide a semiconductor body into separate parts, e.g. making partitions
Applicants
  • 浜松ホトニクス株式会社 HAMAMATSU PHOTONICS K.K. [JP]/[JP]
Inventors
  • 坂本 剛志 SAKAMOTO Takeshi
  • 是松 克洋 KOREMATSU Katsuhiro
Agents
  • 長谷川 芳樹 HASEGAWA Yoshiki
  • 黒木 義樹 KUROKI Yoshiki
  • 柴山 健一 SHIBAYAMA Kenichi
Priority Data
2018-20411430.10.2018JP
2019-07317905.04.2019JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) LASER MACHINING DEVICE AND LASER MACHINING METHOD
(FR) DISPOSITIF D'USINAGE AU LASER ET PROCÉDÉ D'USINAGE AU LASER
(JA) レーザ加工装置及びレーザ加工方法
Abstract
(EN)
This laser machining device comprises: a support unit; an irradiation unit; a movement mechanism; a control unit; and an imaging unit. The control unit executes first pre-processing in which a modified region is formed on a target by irradiating the target with laser light along a machining line having multiple parallel lines arranged side by side. The imaging unit acquires a first image that shows a machining state where, in the first pre-processing, the modified region is formed along the machining line having multiple parallel lines.
(FR)
Le présent dispositif d'usinage laser comprend : une unité de support ; une unité d'irradiation ; un mécanisme de mouvement ; une unité de commande ; et une unité d'imagerie. L'unité de commande exécute un premier prétraitement dans lequel une région modifiée est formée sur une cible en irradiant la cible avec une lumière laser le long d'une ligne d'usinage ayant de multiples lignes parallèles disposées côte à côte. L'unité d'imagerie obtient une première image qui présente un état d'usinage dans lequel, dans le premier prétraitement, la région modifiée est formée le long de la ligne d'usinage ayant de multiples lignes parallèles.
(JA)
レーザ加工装置は、支持部と、照射部と、移動機構と、制御部と、撮像部と、を備える。制御部は、並ぶように配された複数の並行ラインを有する加工用ラインに沿って、レーザ光を対象物に照射させて、改質領域を対象物に形成する第1前処理を実行する。撮像部は、第1前処理により複数の並行ラインを有する加工用ラインに沿って改質領域を形成した場合の加工状態を映す第1画像を取得する。
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