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1. WO2020090889 - LASER DEVICE AND LASER PROCESSING DEVICE

Publication Number WO/2020/090889
Publication Date 07.05.2020
International Application No. PCT/JP2019/042584
International Filing Date 30.10.2019
IPC
B23K 26/064 2014.01
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
06Shaping the laser beam, e.g. by masks or multi-focusing
064by means of optical elements, e.g. lenses, mirrors or prisms
B23K 26/53 2014.01
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
50Working by transmitting the laser beam through or within the workpiece
53for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
H01L 21/301 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18the devices having semiconductor bodies comprising elements of group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
301to subdivide a semiconductor body into separate parts, e.g. making partitions
Applicants
  • 浜松ホトニクス株式会社 HAMAMATSU PHOTONICS K.K. [JP]/[JP]
Inventors
  • 海老原 次郎 EBIHARA Jiro
  • 坂本 剛志 SAKAMOTO Takeshi
Agents
  • 長谷川 芳樹 HASEGAWA Yoshiki
  • 黒木 義樹 KUROKI Yoshiki
  • 柴山 健一 SHIBAYAMA Kenichi
Priority Data
2018-20411430.10.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) LASER DEVICE AND LASER PROCESSING DEVICE
(FR) DISPOSITIF LASER ET DISPOSITIF DE TRAITEMENT PAR LASER
(JA) レーザ装置、及び、レーザ加工装置
Abstract
(EN)
This laser device is provided with: a light source unit which outputs laser light; an amplification unit which has an amplification part that amplifies the laser light output from the light source unit; an output unit which outputs the laser light that has been amplified by the amplification part to the outside; and an optical isolator for blocking return light to the amplification part from the outside. The output unit is configured separately from the light source unit and the amplification unit; the light source unit, the amplification unit and the output unit are optically connected to each other by means of an optical transmission line that comprises a plurality of optical fibers; and the optical isolator is provided on the optical transmission line between the amplification part and the output unit.
(FR)
La présente invention concerne un dispositif laser comportant: une unité de source lumineuse qui délivre une lumière laser; une unité d'amplification dotée d'une partie d'amplification qui amplifie la lumière laser délivrée à partir de l'unité de source lumineuse; une unité de sortie qui délivre vers l'extérieur la lumière laser qui a été amplifiée par la partie d'amplification; et un isolateur optique servant à bloquer une lumière de retour vers la partie d'amplification en provenance de l'extérieur. L'unité de sortie est configurée séparément de l'unité de source lumineuse et l'unité d'amplification; l'unité de source lumineuse, l'unité d'amplification et l'unité de sortie sont reliées optiquement les unes aux autres au moyen d'une ligne de transmission optique qui comporte une pluralité de fibres optiques; et l'isolateur optique est placé sur la ligne de transmission optique entre la partie d'amplification et l'unité de sortie.
(JA)
レーザ装置は、レーザ光を出力する光源ユニットと、前記光源ユニットから出力された前記レーザ光を増幅する増幅部を有する増幅ユニットと、前記増幅部により増幅された前記レーザ光を外部に出力する出力ユニットと、外部から前記増幅部への戻り光を遮断するための光アイソレータと、を備え、前記出力ユニットは、前記光源ユニット及び前記増幅ユニットと別体に構成され、前記光源ユニットと前記増幅ユニットと前記出力ユニットとは、複数の光ファイバを含む光伝送路によって互いに光学的に接続されており、前記光アイソレータは、前記増幅部と前記出力ユニットとの間において、前記光伝送路に設けられている。
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