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1. WO2020090727 - ELECTROMAGNETIC WAVE SHIELDING FILM, METHOD OF MANUFACTURING SHIELDED PRINTED WIRING BOARD, AND SHIELDED PRINTED WIRING BOARD

Publication Number WO/2020/090727
Publication Date 07.05.2020
International Application No. PCT/JP2019/042154
International Filing Date 28.10.2019
IPC
H05K 9/00 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
9Screening of apparatus or components against electric or magnetic fields
B32B 7/025 2019.01
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
7Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
02Physical, chemical or physicochemical properties
025Electric or magnetic properties
H05K 1/02 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
H05K 3/28 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
22Secondary treatment of printed circuits
28Applying non-metallic protective coatings
Applicants
  • タツタ電線株式会社 TATSUTA ELECTRIC WIRE & CABLE CO., LTD. [JP]/[JP]
Inventors
  • 高見 晃司 TAKAMI, Kouji
  • 上農 憲治 KAMINO, Kenji
  • 渡辺 正博 WATANABE, Masahiro
Agents
  • 特許業務法人 安富国際特許事務所 YASUTOMI & ASSOCIATES
Priority Data
2018-20293329.10.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) ELECTROMAGNETIC WAVE SHIELDING FILM, METHOD OF MANUFACTURING SHIELDED PRINTED WIRING BOARD, AND SHIELDED PRINTED WIRING BOARD
(FR) FILM DE BLINDAGE CONTRE LES ONDES ÉLECTROMAGNÉTIQUES, PROCÉDÉ DE FABRICATION DE CARTE DE CIRCUIT IMPRIMÉ BLINDÉE ET CARTE DE CIRCUIT IMPRIMÉ BLINDÉE
(JA) 電磁波シールドフィルム、シールドプリント配線板の製造方法、及び、シールドプリント配線板
Abstract
(EN)
Provided is an electromagnetic wave shielding film for manufacturing a shielded printed wiring board that has sufficiently small connection resistance between a ground circuit and a shielding layer. This electromagnetic wave shielding film is characterized by comprising a protective layer, a shielding layer that is stacked on the protective layer, and an adhesive layer that is stacked on the shielding layer, wherein a conductive bump is formed on the adhesive layer side of the shielding layer and the conductive bump has a volume of 30000 to 400000 μm3.
(FR)
L'invention concerne un film de blindage contre les ondes électromagnétiques pour fabriquer une carte de circuit imprimé blindée qui présente une résistance de connexion suffisamment petite entre un circuit de terre et une couche de blindage. Ce film de blindage contre les ondes électromagnétiques est caractérisé en ce qu'il comprend une couche de protection, une couche de blindage qui est empilée sur la couche de protection, et une couche adhésive qui est empilée sur la couche de blindage, une bosse conductrice étant formée sur le côté de la couche adhésive de la couche de blindage et la bosse conductrice ayant un volume de 30000 à 400000 µm3.
(JA)
グランド回路-シールド層間の接続抵抗が充分に小さいシールドプリント配線板を製造するための電磁波シールドフィルムを提供する。 本発明の電磁波シールドフィルムは、保護層と、上記保護層に積層されたシールド層と、上記シールド層に積層された接着剤層とからなり、上記シールド層の上記接着剤層側には導電性バンプが形成されており、上記導電性バンプの体積は、30000~400000μmであることを特徴とする。
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