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1. WO2020090684 - METHOD FOR MANUFACTURING CONNECTED BODY, ANISOTROPIC BONDING FILM, AND CONNECTED BODY

Publication Number WO/2020/090684
Publication Date 07.05.2020
International Application No. PCT/JP2019/042035
International Filing Date 25.10.2019
IPC
H01R 11/01 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
11Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
01characterised by the form or arrangement of the conductive interconnection between their connecting locations
C08K 3/08 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3Use of inorganic substances as compounding ingredients
02Elements
08Metals
C08K 5/09 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5Use of organic ingredients
04Oxygen-containing compounds
09Carboxylic acids; Metal salts thereof; Anhydrides thereof
C08L 101/00 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
101Compositions of unspecified macromolecular compounds
H01L 21/60 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
60Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
H01L 33/62 2010.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
62Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
Applicants
  • デクセリアルズ株式会社 DEXERIALS CORPORATION [JP]/[JP]
Inventors
  • 石松 朋之 ISHIMATSU, Tomoyuki
  • 阿部 智幸 ABE, Tomoyuki
  • 青木 正治 AOKI, Masaharu
Agents
  • 野口 信博 NOGUCHI, Nobuhiro
Priority Data
2018-20605831.10.2018JP
2019-19447925.10.2019JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) METHOD FOR MANUFACTURING CONNECTED BODY, ANISOTROPIC BONDING FILM, AND CONNECTED BODY
(FR) PROCÉDÉ DE FABRICATION D'UN CORPS CONNECTÉ, FILM DE LIAISON ANISOTROPE ET CORPS CONNECTÉ
(JA) 接続体の製造方法、異方性接合フィルム、接続体
Abstract
(EN)
Provided are a method for manufacturing a connected body that is capable of bonding electronic components having fine-pitch electrodes, an anisotropic bonding film, and a connected body. An anisotropic bonding material which comprises solder particles, a flux compound, and at least one solid resin selected from among a thermoplastic resin, a solid radically polymerizable resin, and a solid epoxy resin that are solid at normal temperature and have a melt flow rate of 10 g/10 min or more measured under the condition of a temperature of 190°C and a load of 2.16 kg is interposed between an electrode of a first electronic component and an electrode of a second electronic component in a thickness that is 50 to 300% of the average particle size of the solder particles, and the electrode of the first electronic component and the electrode of the second electronic component are heat-bonded with no load.
(FR)
L'invention concerne un procédé de fabrication d'un corps connecté qui est apte à lier des composants électroniques ayant des électrodes à pas fin, un film de liaison anisotrope et un corps connecté. Un matériau de liaison anisotrope qui comprend des particules de brasure, un composé de flux et au moins une résine solide choisie parmi une résine thermoplastique, une résine polymérisable par voie radicalaire, et une résine époxy solide qui sont solides à température normale et ont un indice de fluidité de 10 g/10 min ou plus mesuré dans les conditions telles qu'une température de 190 °C et une charge de 2,16 kg est interposée entre une électrode d'un premier composant électronique et une électrode d'un second composant électronique avec une épaisseur qui est de 50 à 300 % la taille moyenne de particule des particules de brasure, et l'électrode du premier composant électronique et l'électrode du second composant électronique sont liées thermiquement sans aucune charge.
(JA)
ファインピッチの電極を備える電子部品を接合させることができる接続体の製造方法、異方性接合フィルム、接続体を提供する。常温で固形であり、温度190℃、荷重2.16kgの条件で測定されたメルトフローレートが10g/10min以上である熱可塑性樹脂、固形ラジカル重合性樹脂、及び固形エポキシ樹脂から選ばれる少なくとも1種の固形樹脂と、はんだ粒子と、フラックス化合物とを含有する異方性接合材料を、第1の電子部品の電極と第2の電子部品の電極との間にはんだ粒子の平均粒径の50%以上300%以下の厚みで介在させ、第1の電子部品の電極と第2の電子部品の電極とを無荷重で加熱接合させる。
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