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1. WO2020090643 - SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD

Publication Number WO/2020/090643
Publication Date 07.05.2020
International Application No. PCT/JP2019/041866
International Filing Date 25.10.2019
IPC
H01L 21/304 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18the devices having semiconductor bodies comprising elements of group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
304Mechanical treatment, e.g. grinding, polishing, cutting
B05C 11/00 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
05SPRAYING OR ATOMISING IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
CAPPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
11Component parts, details or accessories not specifically provided for in groups B05C1/-B05C9/132
B05C 11/08 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
05SPRAYING OR ATOMISING IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
CAPPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
11Component parts, details or accessories not specifically provided for in groups B05C1/-B05C9/132
02Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface; Control of the thickness of a coating
08Spreading liquid or other fluent material by manipulating the work, e.g. tilting
B05C 11/10 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
05SPRAYING OR ATOMISING IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
CAPPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
11Component parts, details or accessories not specifically provided for in groups B05C1/-B05C9/132
10Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
H01L 21/027 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
027Making masks on semiconductor bodies for further photolithographic processing, not provided for in group H01L21/18 or H01L21/34165
Applicants
  • 株式会社SCREENホールディングス SCREEN HOLDINGS CO., LTD. [JP]/[JP]
Inventors
  • 猶原 英司 NAOHARA Hideji
  • 角間 央章 KAKUMA Hiroaki
Agents
  • 吉竹 英俊 YOSHITAKE Hidetoshi
  • 有田 貴弘 ARITA Takahiro
Priority Data
2018-20731802.11.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD
(FR) DISPOSITIF DE TRAITEMENT DE SUBSTRAT ET PROCÉDÉ DE TRAITEMENT DE SUBSTRAT
(JA) 基板処理装置および基板処理方法
Abstract
(EN)
Provided is a technology for suitably associating a plurality of cameras and respective areas to be image-captured by the plurality of cameras. This substrate processing device (100) processes a substrate (W). The substrate processing device (100) includes: a plurality of cleaning processing units (1); a plurality of cameras (70) which capture images of areas (PA) to be image-captured that are different from each other; an image processing unit (815) which processes the images (PH) captured by each camera (70); and an association processing unit (814) which respectively associates the areas (PA) to be image-captured with the cameras (70) in response to the image processing of the image processing unit (815).
(FR)
L'invention concerne une technologie permettant d'associer de manière appropriée une pluralité de caméras et des zones respectives à capturer par image par la pluralité de caméras. Ce dispositif de traitement de substrat (100) traite un substrat (W). Le dispositif de traitement de substrat (100) comprend : une pluralité d'unités de traitement de nettoyage (1) ; une pluralité de caméras (70) qui capturent des images de zones (PA) devant être capturées par image qui sont différentes les unes des autres ; une unité de traitement d'image (815) qui traite les images (PH) capturées par chaque caméra (70) ; et une unité de traitement d'association (814) qui associe respectivement les zones (PA) à capturer par image avec les caméras (70) en réponse au traitement d'image de l'unité de traitement d'image (815).
(JA)
複数のカメラとそれらが撮像する各被写領域とを適正に紐付けする技術を提供する。基板処理装置(100)は、基板(W)を処理する装置である。基板処理装置(100)は、複数の洗浄処理ユニット(1)と、互いに異なる被写領域(PA)を撮像する複数のカメラ(70)と、各カメラ(70)が撮像する画像(PH)を処理する画像処理部(815)と、画像処理部(815)の画像処理に応じて、各被写領域(PA)と各カメラ(70)とを紐付ける紐付処理部(814)とを備える。
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