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1. WO2020090565 - INSULATION FILM FORMING RESIN COMPOSITION, INSULATION FILM FORMING RESIN COMPOSITION PRODUCTION METHOD, DRY FILM, PRINTED CIRCUIT BOARD, AND PRINTED CIRCUIT BOARD PRODUCTION METHOD

Publication Number WO/2020/090565
Publication Date 07.05.2020
International Application No. PCT/JP2019/041443
International Filing Date 23.10.2019
IPC
G03F 7/004 2006.01
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
C08F 290/14 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
290Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
08on to polymers modified by introduction of unsaturated side groups
14Polymers provided for in subclass C08G52
C08G 59/16 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
59Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
14Polycondensates modified by chemical after-treatment
16by monocarboxylic acids or by anhydrides, halides or low-molecular-weight esters thereof
G03F 7/027 2006.01
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
H01L 21/312 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18the devices having semiconductor bodies comprising elements of group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
31to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After-treatment of these layers; Selection of materials for these layers
312Organic layers, e.g. photoresist
H05K 3/28 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
22Secondary treatment of printed circuits
28Applying non-metallic protective coatings
Applicants
  • 互応化学工業株式会社 GOO CHEMICAL CO., LTD. [JP]/[JP]
Inventors
  • 樋口 倫也 HIGUCHI, Michiya
  • 鈴木 文人 SUZUKI, Fumito
  • 橋本 壯一 HASHIMOTO, Soichi
  • 荒井 貴 ARAI, Takashi
Agents
  • 特許業務法人北斗特許事務所 HOKUTO PATENT ATTORNEYS OFFICE
Priority Data
2018-20355730.10.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) INSULATION FILM FORMING RESIN COMPOSITION, INSULATION FILM FORMING RESIN COMPOSITION PRODUCTION METHOD, DRY FILM, PRINTED CIRCUIT BOARD, AND PRINTED CIRCUIT BOARD PRODUCTION METHOD
(FR) COMPOSITION DE RÉSINE FORMANT UN FILM D'ISOLATION, PROCÉDÉ DE PRODUCTION D'UNE COMPOSITION DE RÉSINE FORMANT UN FILM D'ISOLATION, FILM SEC, CARTE À CIRCUIT IMPRIMÉ, ET PROCÉDÉ DE PRODUCTION D'UNE CARTE À CIRCUIT IMPRIMÉ
(JA) 絶縁膜形成用の樹脂組成物、絶縁膜形成用の樹脂組成物の製造方法、ドライフィルム、プリント配線板、及びプリント配線板の製造方法
Abstract
(EN)
The objective of the present invention is to provide a resin composition which has stable viscosity, a coating film formed from same exhibiting high uniformity in terms of film thickness, while also being highly thixotropic, and which is capable of forming an insulation film having excellent insulation reliability. This insulation film forming resin composition contains a curable resin (A), bentonite (E), a first flux (F1), and a second flux (F2). The solubility of the flux (F1) in 1 L of water at 20°C is 1 g or greater, and the solubility of the second flux (F2) in 1 L of water at 20°C is less than 1 g. Relative to the entire amount of the resin composition, the total amount of the first flux (F1) and the second flux (F2) is between 15% by mass and 50% by mass inclusive. Relative to the total amount of the first flux (F1) and the second flux (F2), the amount of the second flux (F2) is between 15% by mass and 50% by mass inclusive.
(FR)
La présente invention a pour objectif de fournir une composition de résine qui présente une viscosité stable, un film de revêtement formé à partir de celle-ci présentant une uniformité élevée en termes d'épaisseur de film, tout en étant également fortement thixotrope, et qui est capable de former un film d'isolation présentant une excellente fiabilité d'isolation. Cette composition de résine formant un film d'isolation contient une résine durcissable (A), de la bentonite (E), un premier flux (F1), et un second flux (F2). La solubilité du flux (F1) dans 1 l d'eau à 20°C est d'1 g ou supérieure, et la solubilité du second flux (F2) dans 1 l d'eau à 20°C est de moins de 1 g. Par rapport à la quantité entière de la composition de résine, la quantité totale du premier flux (F1) et du second flux (F2) est comprise entre 15% en masse et 50% en masse inclus. Par rapport à la quantité totale du premier flux (F1) et du second flux (F2), la quantité du second flux (F2) est comprise entre 15% en masse et 50% en masse inclus.
(JA)
本発明の目的は、安定した粘度を有し、かつその塗膜の膜厚が高い均一性及び高いチクソ性を有し、優れた絶縁信頼性を有する絶縁膜を形成可能な樹脂組成物を提供する。絶縁膜形成用の樹脂組成物は、硬化性樹脂(A)、ベントナイト(E)、第一の溶剤(F1)及び第二の溶剤(F2)を含有する。溶剤(F1)の20℃における水1Lに対する溶解度は、1g以上であり、第二の溶剤(F2)の20℃における水1Lに対する溶解度は、1g未満である。樹脂組成物全量に対する第一の溶剤(F1)と第二の溶剤(F2)との合計量は、15質量%以上50質量%以下である。第一の溶剤(F1)と第二の溶剤(F2)との合計量に対する第二の溶剤(F2)の量は、15質量%以上50質量%以下である。
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