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1. WO2020090379 - BOARD-LIKE STRUCTURE AND HEATER SYSTEM

Publication Number WO/2020/090379
Publication Date 07.05.2020
International Application No. PCT/JP2019/039687
International Filing Date 08.10.2019
IPC
H05B 3/20 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
BELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
3Ohmic-resistance heating
20Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
H01L 21/02 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
H01L 21/683 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
683for supporting or gripping
H05B 3/02 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
BELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
3Ohmic-resistance heating
02Details
H05B 3/12 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
BELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
3Ohmic-resistance heating
10Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
12characterised by the composition or nature of the conductive material
Applicants
  • 京セラ株式会社 KYOCERA CORPORATION [JP]/[JP]
Inventors
  • 川邊 保典 KAWANABE, Yasunori
  • 大川 善裕 OKAWA, Yoshihiro
Agents
  • 飯島 康弘 IIJIMA, YASUHIRO
Priority Data
2018-20380530.10.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) BOARD-LIKE STRUCTURE AND HEATER SYSTEM
(FR) STRUCTURE DE TYPE PANNEAU ET SYSTÈME DE CHAUFFAGE
(JA) 基板状構造体及びヒータシステム
Abstract
(EN)
A board-like structure that has a substrate, an internal conductor, and a terminal member. The substrate is an insulating member that has an upper surface and a lower surface that is on the reverse side from the upper surface. The internal conductor runs parallel to the upper surface and the lower surface of the substrate inside the substrate. The terminal member is electrically connected to the internal conductor, and at least a portion of the terminal member is positioned inside the substrate and exposed to the outside of the substrate at the lower surface of the substrate. The terminal member has an insulating terminal base part and a conductive layer that is located at the surface of the terminal base part.
(FR)
L'invention concerne une structure de type panneau qui comporte un substrat, un conducteur interne et un élément borne. Le substrat est un élément isolant qui présente une surface supérieure et une surface inférieure qui se trouve sur le côté opposé de la première surface. Le conducteur interne s'étend parallèlement à la surface supérieure et à la surface inférieure du substrat à l'intérieur du substrat. L'élément borne est électriquement connecté au conducteur interne, et au moins une partie de l'élément borne est positionnée à l'intérieur du substrat et exposée à l'extérieur du substrat au niveau de la surface inférieure du substrat. L'élément borne comprend une partie de base de borne isolante et une couche conductrice qui est située au niveau de la surface de la partie de base de borne.
(JA)
基板状構造体は、基体と、内部導体と、端子部材とを有している。基体は、上面及びその反対側の下面を有している絶縁性の部材である。内部導体は、基体内にて基体の上面及び下面に沿っている。端子部材は、少なくとも一部が基体内に位置しているとともに基体の下面にて基体の外部へ露出しており、内部導体に電気的に接続されている。端子部材は、絶縁性の端子基部と、端子基部の表面に位置している導体層と、を有している。
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