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1. WO2020090230 - HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE

Publication Number WO/2020/090230
Publication Date 07.05.2020
International Application No. PCT/JP2019/035132
International Filing Date 06.09.2019
IPC
H04B 1/38 2015.01
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
BTRANSMISSION
1Details of transmission systems, not covered by a single one of groups H04B3/-H04B13/123; Details of transmission systems not characterised by the medium used for transmission
38Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
H03H 7/46 2006.01
HELECTRICITY
03BASIC ELECTRONIC CIRCUITRY
HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
7Multiple-port networks comprising only passive electrical elements as network components
46Networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
H03H 9/70 2006.01
HELECTRICITY
03BASIC ELECTRONIC CIRCUITRY
HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
9Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
70Multiple-port networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common or source
H03H 9/72 2006.01
HELECTRICITY
03BASIC ELECTRONIC CIRCUITRY
HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
9Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
70Multiple-port networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common or source
72Networks using surface acoustic waves
Applicants
  • 株式会社村田製作所 MURATA MANUFACTURING CO., LTD. [JP]/[JP]
Inventors
  • 竹松 佑二 TAKEMATSU, Yuji
  • 上嶋 孝紀 UEJIMA, Takanori
  • 松本 翔 MATSUMOTO, Sho
  • 原田 哲郎 HARADA, Tetsuro
  • 中川 大 NAKAGAWA, Dai
  • 松本 直也 MATSUMOTO, Naoya
  • 佐々木 豊 SASAKI, Yutaka
  • 福田 裕基 FUKUDA, Yuuki
Agents
  • 吉川 修一 YOSHIKAWA, Shuichi
  • 傍島 正朗 SOBAJIMA, Masaaki
Priority Data
2018-20663501.11.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE
(FR) MODULE HAUTE FRÉQUENCE ET DISPOSITIF DE COMMUNICATION
(JA) 高周波モジュールおよび通信装置
Abstract
(EN)
A high-frequency module (1A) is provided with: a module substrate (70B) having main surfaces (701 and 702); a module substrate (70A) having main surfaces (703 and 704) with the main surface (703) facing the main surface (702); a transmission filter (12) having a mounting surface (122) and a top surface (121), the mounting surface (122) being disposed facing the main surface (702); and a reception filter (22) having a mounting surface (222) and a top surface (221), the mounting surface (222) being disposed facing the main surface (703). When the substrates are viewed in plan, the transmission filter (12) and the reception filter (22) partly overlap each other. The transmission filter (12) has an output terminal (12c) disposed on the top surface (121), and the reception filter (22) has an input terminal (22a) disposed on the top surface (221), wherein the output terminal (12c) and the input terminal (22a) are connected by means of connecting electrodes (81b and 82b) that do not pass through the module substrates (70A and 70B).
(FR)
La présente invention concerne un module haute fréquence (1A) comprenant : un substrat de module (70B) ayant des surfaces principales (701 et 702); un substrat de module (70A) ayant des surfaces principales (703 et 704) avec la surface principale (703) faisant face à la surface principale (702); un filtre de transmission (12) ayant une surface de montage (122) et une surface supérieure (121), la surface de montage (122) étant disposée en regard de la surface principale (702); et un filtre de réception (22) ayant une surface de montage (222) et une surface supérieure (221), la surface de montage (222) étant disposée en regard de la surface principale (703). Lorsque les substrats sont visualisés en plan, le filtre de transmission (12) et le filtre de réception (22) se chevauchent partiellement. Le filtre de transmission (12) a une borne de sortie (12c) disposée sur la surface supérieure (121), et le filtre de réception (22) a une borne d'entrée (22a) disposée sur la surface supérieure (221), la borne de sortie (12c) et la borne d'entrée (22a) étant reliées au moyen d'électrodes de connexion (81b et 82b) qui ne traversent pas les substrats de module (70A et 70B).
(JA)
高周波モジュール(1A)は、主面(701および702)を有するモジュール基板(70B)と、主面(703および704)を有し主面(703)が主面(702)と対面するモジュール基板(70A)と、実装面(122)および天面(121)を有し実装面(122)が主面(702)と対面配置された送信フィルタ(12)と、実装面(222)および天面(221)を有し実装面(222)が主面(703)と対面配置された受信フィルタ(22)と、を備え、基板を平面視した場合に、送信フィルタ(12)と受信フィルタ(22)とは一部が重複しており、送信フィルタ(12)の出力端子(12c)は天面(121)に配置され、受信フィルタ(22)の入力端子(22a)は天面(221)に配置され、出力端子(12c)と入力端子(22a)とは、モジュール基板(70Aおよび70B)を経由しない接続電極(81bおよび82b)により接続されている。
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