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1. WO2020090219 - IMAGING ELEMENT AND IMAGING DEVICE

Publication Number WO/2020/090219
Publication Date 07.05.2020
International Application No. PCT/JP2019/034567
International Filing Date 03.09.2019
IPC
H01L 27/146 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
14including semiconductor components sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
144Devices controlled by radiation
146Imager structures
H01L 23/00 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
H04N 5/335 2011.01
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
NPICTORIAL COMMUNICATION, e.g. TELEVISION
5Details of television systems
30Transforming light or analogous information into electric information
335using solid-state image sensors
H04N 5/357 2011.01
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
NPICTORIAL COMMUNICATION, e.g. TELEVISION
5Details of television systems
30Transforming light or analogous information into electric information
335using solid-state image sensors
357Noise processing, e.g. detecting, correcting, reducing or removing noise
Applicants
  • ソニーセミコンダクタソリューションズ株式会社 SONY SEMICONDUCTOR SOLUTIONS CORPORATION [JP]/[JP]
Inventors
  • 堀 清隆 HORI Kiyotaka
  • 茅野 大祐 CHINO Daisuke
Agents
  • 松尾 憲一郎 MATSUO Kenichiro
Priority Data
2018-20271929.10.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) IMAGING ELEMENT AND IMAGING DEVICE
(FR) ÉLÉMENT D'IMAGERIE ET DISPOSITIF D'IMAGERIE
(JA) 撮像素子および撮像装置
Abstract
(EN)
The present invention prevents a short circuit in an imaging element that is provided with an electromagnetic shield. An imaging element according to the present invention is provided with an electromagnetic shield and an adhesive. The electromagnetic shield is arranged between a wiring line and an imaging chip in a package that is internally provided with the wiring line, while having a recessed part in which the imaging chip is mounted. The adhesive is used for the mounting of the imaging chip. In addition, the adhesive is arranged so as to cover the electromagnetic shield.
(FR)
La présente invention empêche un court-circuit dans un élément d'imagerie qui comporte un blindage électromagnétique. Un élément d'imagerie selon la présente invention comporte un blindage électromagnétique et un adhésif. Le blindage électromagnétique est disposé entre une ligne de câblage et une puce d'imagerie dans un boîtier qui comporte intérieurement la ligne de câblage, tout en ayant une partie évidée dans laquelle la puce d'imagerie est montée. L'adhésif est utilisé pour le montage de la puce d'imagerie. De plus, l'adhésif est agencé de manière à recouvrir le blindage électromagnétique.
(JA)
電磁シールドが配置された撮像素子におけるショートを防止する。 撮像素子は、電磁シールドと、接着剤とを具備する撮像素子である。電磁シールドは、内部に配線を備え、撮像チップを搭載するための凹部が設けられているパッケージにおいて、配線と撮像チップとの間に配置される電磁シールドである。また、接着剤は、撮像チップを搭載するために用いる接着剤である。また、接着剤は、電磁シールドを覆うように配置される。
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