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1. WO2020089036 - TRANSFER TOOL AND METHOD FOR TRANSFERRING SEMICONDUCTOR CHIPS

Publication Number WO/2020/089036
Publication Date 07.05.2020
International Application No. PCT/EP2019/079071
International Filing Date 24.10.2019
IPC
H01L 21/67 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/683 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
683for supporting or gripping
CPC
H01L 21/67132
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67011Apparatus for manufacture or treatment
67132Apparatus for placing on an insulating substrate, e.g. tape
H01L 21/67144
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67011Apparatus for manufacture or treatment
67144Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
H01L 21/67271
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67242Apparatus for monitoring, sorting or marking
67271Sorting devices
H01L 21/683
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
683for supporting or gripping
Applicants
  • OSRAM OPTO SEMICONDUCTORS GMBH [DE]/[DE]
Inventors
  • PLÖSSL, Andreas
Agents
  • EPPING HERMANN FISCHER PATENTANWALTSGESELLSCHAFT MBH
Priority Data
10 2018 127 123.930.10.2018DE
Publication Language German (DE)
Filing Language German (DE)
Designated States
Title
(DE) TRANSFERWERKZEUG UND VERFAHREN ZUM TRANSFERIEREN VON HALBLEITERCHIPS
(EN) TRANSFER TOOL AND METHOD FOR TRANSFERRING SEMICONDUCTOR CHIPS
(FR) OUTIL DE TRANSFERT ET PROCÉDÉ POUR TRANSFÉRER DES PUCES SEMI-CONDUCTRICES
Abstract
(DE)
Es wird ein Transferwerkzeug (1) zum Transfer eines HalbleiterChips (2) angegeben mit - einem Haftstempel (3), der eine Anhaftfläche (4) zur Aufnahme des HalbleiterChips (2) aufweist, und - Vorrichtung (15) zur Einstellung eines Flächeninhalts der Anhaftfläche (4), wobei - der Haftstempel (3) verformbar ausgebildet ist, - die Anhaftfläche (4) durch einen Teil der Außenfläche des Haftstempels (3) gebildet ist, und - der Flächeninhalt der Anhaftfläche (4) durch Verformung des Haftstempels (3) einstellbar ist. Darüber hinaus wird ein Verfahren zum Transferieren von HalbleiterChips (2) angegeben.
(EN)
The invention relates to a transfer tool (1) for transferring a semiconductor chip (2), comprising: an adhesive stamp (3), which has an adhesive surface (4) for receiving the semiconductor chip (2); and a device (15) for adjusting the surface area of the adhesive surface (4), wherein: the adhesive stamp (3) can be deformed; the adhesive surface (4) is formed by part of the exterior surface of the adhesive stamp (3); and the surface area of the adhesive surface (4) can be adjusted by deformation of the adhesive stamp (3). The invention further relates to a method for transferring semiconductor chips (2).
(FR)
L’invention concerne un outil de transfert (1) pour transférer une puce semi-conductrice (2) comprenant un tampon adhésif (3) qui présente une surface d’adhérence (4) destinée à recevoir la puce semi-conductrice (2), et un dispositif (15) permettant de régler la superficie de la surface d’adhérence (4), le tampon adhésif (3) étant conçu de manière à être déformable, la surface d’adhérence (4) étant formée par une partie de la surface extérieure du tampon adhésif (3), et la superficie de la surface d’adhérence (4) pouvant être réglée par déformation du tampon adhésif (3). L’invention concerne également un procédé pour transférer des puces semi-conductrices (2).
Also published as
Latest bibliographic data on file with the International Bureau