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1. WO2020088901 - METHOD FOR MANUFACTURING A LIGHT SOURCE ARRANGEMENT AND LIGHT SOURCE ARRANGEMENT MANUFACTURED ACCORDING TO SUCH A METHOD

Publication Number WO/2020/088901
Publication Date 07.05.2020
International Application No. PCT/EP2019/077327
International Filing Date 09.10.2019
IPC
B60Q 1/00 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
60VEHICLES IN GENERAL
QARRANGEMENT OF SIGNALLING OR LIGHTING DEVICES, THE MOUNTING OR SUPPORTING THEREOF OR CIRCUITS THEREFOR, FOR VEHICLES IN GENERAL
1Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor
H01L 25/16 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices
16the devices being of types provided for in two or more different main groups of groups H01L27/-H01L51/139
H05B 33/08 2020.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
BELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
33Electroluminescent light sources
08Circuit arrangements for operating electroluminescent light sources
CPC
B60Q 1/00
BPERFORMING OPERATIONS; TRANSPORTING
60VEHICLES IN GENERAL
QARRANGEMENT OF SIGNALLING OR LIGHTING DEVICES, THE MOUNTING OR SUPPORTING THEREOF OR CIRCUITS THEREFOR, FOR VEHICLES IN GENERAL
1Arrangements or adaptations of optical signalling or lighting devices
H01L 25/0753
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; ; Multistep manufacturing processes thereof
03all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes
04the devices not having separate containers
075the devices being of a type provided for in group H01L33/00
0753the devices being arranged next to each other
H01L 25/167
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; ; Multistep manufacturing processes thereof
16the devices being of types provided for in two or more different main groups of H01L27/00 - H01L49/00 ; and H01L51/00; , e.g. forming hybrid circuits
167comprising optoelectronic devices, e.g. LED, photodiodes
H05B 33/08
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
BELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
33Electroluminescent light sources
02Details
08Circuit arrangements for operating electroluminescent light sources
Applicants
  • AUTOMOTIVE LIGHTING REUTLINGEN GMBH [DE]/[DE]
Inventors
  • LEIPERT, Anna
Agents
  • WÖRZ, Volker
Priority Data
10 2018 127 115.830.10.2018DE
Publication Language German (DE)
Filing Language German (DE)
Designated States
Title
(DE) VERFAHREN ZUM HERSTELLEN EINER LICHTQUELLENANORDNUNG UND NACH EINEM SOLCHEN VERFAHREN HERGESTELLTE LICHTQUELLENANORDNUNG
(EN) METHOD FOR MANUFACTURING A LIGHT SOURCE ARRANGEMENT AND LIGHT SOURCE ARRANGEMENT MANUFACTURED ACCORDING TO SUCH A METHOD
(FR) PROCÉDÉ DE FABRICATION D'UN ENSEMBLE DE SOURCES LUMINEUSES ET ENSEMBLE DE SOURCES LUMINEUSES FABRIQUÉ SELON UN TEL PROCÉDÉ
Abstract
(DE)
Die Erfindung betrifft ein Verfahren (51) zum Herstellen einer Lichtquellenanordnung (13) für eine Kraftfahrzeugbeleuchtungseinrichtung (101) mit mindestens einer Leuchtdiode (15) zum Erzeugen von Licht und einem Widerstandselement (17) zum Vorgeben von Eigenschaften der Leuchtdiode (15) an ein Steuergerät (31; 107) zum Steuern und/oder Regeln der Lichtquellenanordnung (13). Es wird ein Verfahren mit den folgenden Schritten vorgeschlagen: - Bereitstellen (55) eines Kühlkörpers (24), - Bereitstellen (57) mindestens einer Top Mount Leuchtdiode (15), - Befestigen (57) der mindestens einen Top Mount Leuchtdiode (15) auf dem Kühlkörper (24), - Bereitstellen (59) eines Schaltungsträgers (21), - Anordnen (59) des Widerstandselements (17) auf dem Schaltungsträger (21), - Herstellen (61) einer elektrischen Verbindung (28) zwischen dem Schaltungsträger (21) und der mindestens einen Top Mount Leuchtdiode (15), - Erfassen (63) der Eigenschaften der Leuchtdiode (15) und - Abgleich (65) eines Widerstandswerts (R) des Widerstandselements (17) in Abhängigkeit von den erfassten Eigenschaften der Leuchtdiode (15).
(EN)
The invention relates to a method (51) for manufacturing a light source arrangement (13) for a motor vehicle illumination device (101) having at least one light-emitting diode (15) for generating light and a resistance element (17) for specifying properties of the light-emitting diode (15) to a control device (31; 107) in order to control the light source arrangement (13) in an open-loop and/or closed-loop manner. The invention relates to a method having the following steps: - providing (55) a heat sink (24), - providing (57) at least one top-mounted light-emitting diode (15), - fastening (57) the at least one top-mounted light-emitting diode (15) on the heat sink (24), - providing (59) a circuit carrier (21), - arranging (59) the resistance element (17) on the circuit carrier (21), - establishing (61) an electrical connection (28) between the circuit carrier (21) and the at least one top-mounted light-emitting diode (15), - detecting (63) the properties of the light-emitting diode (15), and - adjusting (65) a resistance value (R) of the resistance element (17) in accordance with the detected properties of the light-emitting diode (15).
(FR)
L'invention concerne un procédé (51) destiné à fabriquer un agencement de sources lumineuses (13) pour un dispositif d'éclairage de véhicule automobile (101) comprenant au moins une diode électroluminescente (15), destinée à produire de la lumière, et un élément de résistance (17), destiné à prédéfinir des propriétés de la diode électroluminescente (15) au niveau d'un appareil de commande (31; 107) pour commander et/ou régler l'agencement de sources lumineuses (13). L'invention concerne en outre un procédé comprenant les étapes suivantes : - mise à disposition (55) d'un corps de refroidissement (24), - mise à disposition (57) d'au moins une diode électroluminescente de montage supérieur (15), - fixation (57) de ladite diode électroluminescente de montage supérieur (15) sur le corps de refroidissement (24), - mise à disposition (59) d'un support de circuit (21), - agencement (59) de l'élément de résistance (17) sur le support de circuit (21), - fabrication (61) d'une connexion électrique (28) entre le support de circuit (21) et ladite diode électroluminescente de montage supérieur (15), - enregistrement (63) des propriétés de la diode électroluminescente (15), et - équilibrage (65) d'une valeur de résistance (R) de l'élément de résistance (17) en fonction des propriétés enregistrées de la diode électroluminescente (15).
Also published as
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