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1. WO2020088868 - HIGH CURRENT CIRCUIT

Publication Number WO/2020/088868
Publication Date 07.05.2020
International Application No. PCT/EP2019/076506
International Filing Date 01.10.2019
IPC
H05K 1/02 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
H05K 1/11 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
11Printed elements for providing electric connections to or between printed circuits
H05K 1/18 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
18Printed circuits structurally associated with non-printed electric components
CPC
H05K 1/0206
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
0203Cooling of mounted components
0204using means for thermal conduction connection in the thickness direction of the substrate
0206by printed thermal vias
H05K 1/0263
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
0213Electrical arrangements not otherwise provided for
0263High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
H05K 1/113
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
11Printed elements for providing electric connections to or between printed circuits
111Pads for surface mounting, e.g. lay-out
112directly combined with via connections
113Via provided in pad; Pad over filled via
H05K 1/181
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
18Printed circuits structurally associated with non-printed electric components
181associated with surface mounted components
H05K 2201/0376
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
03Conductive materials
0332Structure of the conductor
0364Conductor shape
0376Flush conductors, i.e. flush with the surface of the printed circuit
H05K 2201/0979
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
09Shape and layout
09209Shape and layout details of conductors
09654covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
0979Redundant conductors or connections, i.e. more than one current path between two points
Applicants
  • AUTO-KABEL MANAGEMENT GMBH [DE]/[DE]
Inventors
  • KRATZER, Udo
  • CACCIATORE, David
Agents
  • COHAUSZ & FLORACK PATENT- UND RECHTSANWÄLTE PARTNERSCHAFTSGESELLSCHAFT MBB
Priority Data
10 2018 127 075.530.10.2018DE
Publication Language German (DE)
Filing Language German (DE)
Designated States
Title
(DE) HOCHSTROMSCHALTUNG
(EN) HIGH CURRENT CIRCUIT
(FR) CIRCUIT HAUTE INTENSITÉ
Abstract
(DE)
Hochstromschaltung mit einer Leiterplatte aus einem nichtleitenden Substrat 2, einer auf dem Substrat 2 aufgebrachten Leiterschicht 4 und einer auf der Leiterschicht aufgebrachten Isolationsschicht 6, wobei beidseitig der Leiterpatte jeweils die Isolationsschicht 6 durchbrechende Kontaktpads 8,10,12, 20, 22, 24 angeordnet sind, und die Kontaktpads 8,10,12, 20, 22, 24 über Vias 14 durch dass Substrat 2 hindurch miteinander kontaktiert sind, und wobei die Vias 14 in der Fläche der Kontaktpads 8, 10, 12, 20, 22, 24 angeordnet sind, dadurch gekennzeichnet, dass auf einer ersten Seite der Leiterplatte zumindest ein erstes der Konta ktpads 8 angeordnet ist und auf einer zweiten Seite der Leiterplatte ein erster Halbleiterschalter 28 unmittelbar mit zumindest einem zweiten der Konta ktpads 20 verbunden ist, und dass der Halbleiterschalter 28 mit dem ersten Konta ktpad 8 unmittelbar über die Vias 14 und das zweite Konta ktpad 20, ohne weitere Leiterbahnen, verbunden ist.
(EN)
The invention relates to a high current circuit with a circuit board consisting of a non-conducting substrate 2, a conductor layer 4 applied on the substrate 2 and an insulation layer 6 applied on the conductor layer, wherein contact pads 8, 10, 12, 20, 22, 24 breaking through the insulation layer 6 are arranged on either side of the circuit board and the contact pads 8, 10, 12, 20, 22, 24 are connected to one another through the substrate 2 by vias 14 and the vias 14 are arranged in the surface of the contact pads 8, 10, 12, 20, 22, 24, characterized in that at least one first of the contact pads 8 is arranged on a first side of the circuit board and a first semiconductor switch 28 on a second side of the circuit board is directly connected to at least one second of the contact pads 20, and that the semiconductor switch 28 is connected to the first contact pad 8 directly through the vias 14 and to the second contact pad 20, without further conductor tracks.
(FR)
L'invention concerne un circuit haute intensité comprenant une carte de circuits imprimés composée d'un substrat (2) non conducteur, d'une couche (4) de conducteur appliquée sur le substrat (2) et d'une couche d'isolation (6) appliquée sur la couche de conducteur. Des patins de contact (8, 10, 12, 20, 22, 24) traversant respectivement la couche d'isolation (6) sont disposés de part et d'autre de la carte de circuits imprimés. Les patins de contact (8, 10, 12, 20, 22, 24) sont mis en contact les uns avec les autres au travers du substrat (2) par l'intermédiaire de vias (14). Les vias (14) sont disposés dans la surface des patins de contact (8, 10, 12, 20, 22, 24). Le circuit haute intensité est caractérisé en ce qu'au moins un des patins de contact (8) est disposé sur un premier côté de la carte de circuits imprimés et un premier commutateur semi-conducteur (28) est relié directement à au moins un deuxième des patins de contact (20) sur un deuxième côté de la carte de circuits imprimés. Le commutateur semi-conducteur (28) est relié au premier patin de contact (8) directement par l'intermédiaire des vias (14) et du deuxième patin de contact (20) sans autres pistes conductrices.
Also published as
Latest bibliographic data on file with the International Bureau