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1. WO2020088541 - CHIP PACKAGING STRUCTURE

Publication Number WO/2020/088541
Publication Date 07.05.2020
International Application No. PCT/CN2019/114424
International Filing Date 30.10.2019
IPC
B81B 7/00 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
7Microstructural systems
CPC
B81B 7/0067
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
7Microstructural systems; ; Auxiliary parts of microstructural devices or systems
0032Packages or encapsulation
0067for controlling the passage of optical signals through the package
B81B 7/02
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
7Microstructural systems; ; Auxiliary parts of microstructural devices or systems
02containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
B81C 1/00261
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
1Manufacture or treatment of devices or systems in or on a substrate
00015for manufacturing microsystems
00261Processes for packaging MEMS devices
B81C 1/00317
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
1Manufacture or treatment of devices or systems in or on a substrate
00015for manufacturing microsystems
00261Processes for packaging MEMS devices
00317Packaging optical devices
H01S 5/005
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
5Semiconductor lasers
005Optical devices external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
Applicants
  • 苏州晶方半导体科技股份有限公司 CHINA WAFER LEVEL CSP CO., LTD. [CN]/[CN]
Inventors
  • 王之奇 WANG, Zhiqi
Agents
  • 北京品源专利代理有限公司 BEYOND ATTORNEYS AT LAW
Priority Data
201811275274.630.10.2018CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) CHIP PACKAGING STRUCTURE
(FR) STRUCTURE D'ENCAPSULATION DE PUCES
(ZH) 芯片的封装结构
Abstract
(EN)
A chip packaging structure, comprising: a circuit board (11) having an interconnection circuit connected to an external circuit; and an MEMS chip (13), a VCSEL chip (12), and a light-transmissive cover plate (14) fixed on the circuit board (11), respectively, wherein the MEMS chip (13) and the light-transmissive cover plate (14) are connected to the interconnection circuit, respectively; and a reflection structure (10) disposed on the light-transmissive cover plate (14). An oscillating mirror is provided at the front side of the MEMS chip (13). A first region and a second region are provided on the surface of the light-transmissive cover plate (14) towards the circuit board (11). The first region is configured to emit a laser. The front side of the MEMS chip (13) and that of the VCSEL chip (12) face towards the light-transmissive cover plate (14). The VCSEL chip (12) is configured to transmit a laser. The laser is configured to be reflected to the oscillating mirror by means of the reflection structure (10), reflected to the first region by means of the oscillating mirror, and emitted by means of the first region. The reflection structure (10) comprises a groove (16) formed in the second region, and a reflection layer (17) formed on an inner wall of the groove (16).
(FR)
Structure d'encapsulation de puces, comprenant : une carte de circuit imprimé (11) comportant un circuit d'interconnexion connecté à un circuit externe ; et une puce MEMS (13), une puce VCSEL (12) et une plaque de recouvrement transparente (14), respectivement fixées sur la carte de circuit imprimé (11), la puce MEMS (13) et la plaque de recouvrement transparente (14) étant, respectivement, reliées au circuit d'interconnexion ; et une structure de réflexion (10) disposée sur la plaque de recouvrement transparente (14). Un miroir oscillant est disposé à l'avant de la puce MEMS (13). Une première zone et une seconde zone sont disposées sur la surface de la plaque de recouvrement transparente (14) en direction de la carte de circuit imprimé (11). La première zone est conçue pour émettre un faisceau laser. L'avant de la puce MEMS (13) et celui de la puce VCSEL (12) font face à la plaque de recouvrement transparente (14). La puce VCSEL (12) est conçue pour transmettre un faisceau laser. Le faisceau laser est conçu pour être réfléchi en direction du miroir oscillant au moyen de la structure de réflexion (10), réfléchi en direction de la première zone au moyen du miroir oscillant et émis au moyen de la première zone. La structure de réflexion (10) comprend une rainure (16) formée dans la seconde zone, et une couche de réflexion (17) formée sur une paroi interne de la rainure (16).
(ZH)
一种芯片的封装结构,包括:电路板(11),具有与外部电路连接的互联电路;分别固定在电路板(11)上的MEMS芯片(13)、VCSEL芯片(12)以及透光盖板(14),且MEMS芯片(13)与VCSEL芯片(12)分别与互联电路连接;及反射结构(10),设置于透光盖板(14)上;其中,MEMS芯片(13)的正面具有振镜;透光盖板(14)朝向电路板(11)的表面具有第一区域以及第二区域,第一区域设置为出射激光;MEMS芯片(13)的正面以及VCSEL芯片(12)的正面朝向透光盖板(14),VCSEL芯片(12)设置为发射激光,激光设置为通过反射结构(10)反射至振镜并通过振镜反射至第一区域,及经过第一区域出射;反射结构(10)包括形成在第二区域的凹槽(16)以及形成在凹槽(16)内壁的反射层(17)。
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