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1. WO2020087816 - DISPLAY PANEL, DISPLAY DEVICE, AND METHOD FOR MANUFACTURING DISPLAY PANEL

Publication Number WO/2020/087816
Publication Date 07.05.2020
International Application No. PCT/CN2019/076362
International Filing Date 27.02.2019
IPC
H01L 27/32 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
H01L 51/52 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
52Details of devices
CPC
H01L 27/32
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes [OLED]
H01L 27/3223
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes [OLED]
3223combined with dummy elements, i.e. non-functional features
H01L 51/5237
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED]
52Details of devices
5237Passivation; Containers; Encapsulation, e.g. against humidity
Applicants
  • 昆山国显光电有限公司 KUNSHAN GO-VISIONOX OPTO-ELECTRONICS CO., LTD [CN]/[CN]
Inventors
  • 刘明星 LIU, Mingxing
  • 王徐亮 WANG, Xuliang
  • 张玄 ZHANG, Xuan
  • 甘帅燕 GAN, Shuaiyan
  • 高峰 GAO, Feng
Agents
  • 广东君龙律师事务所 GUANGDONG JUNLONG LAW FIRM
Priority Data
201811280407.930.10.2018CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) DISPLAY PANEL, DISPLAY DEVICE, AND METHOD FOR MANUFACTURING DISPLAY PANEL
(FR) PANNEAU D'AFFICHAGE, DISPOSITIF D'AFFICHAGE ET PROCÉDÉ DE FABRICATION DE PANNEAU D'AFFICHAGE
(ZH) 显示面板、显示装置及显示面板的制造方法
Abstract
(EN)
Disclosed are a display panel (100), a display device (300), and a method for manufacturing the display panel (100). The display panel (100) comprises: a substrate (11), a cover plate (12) and a packaging adhesive (13), wherein a display region (111) and a non-display region (114) surrounding the display region (111) are defined in the substrate (11); the cover plate (12) is arranged on the substrate (11) by means of the packaging adhesive (13); the packaging adhesive (13) is located in the non-display region (114) and is arranged surrounding the display region (111); and the edge of the substrate (11) and/or the edge of the cover plate (12) located outside a ring of encirclement of the packaging adhesive (13) is formed with a thinning portion (112). In the process of cutting a mother board to obtain the display panel (100), it can be ensured that cutting does not affect the quality of the display panel (100).
(FR)
L'invention concerne un panneau d'affichage (100), un dispositif d'affichage (300) ainsi qu'un procédé permettant de fabriquer le panneau d'affichage (100). Le panneau d'affichage (100) comprend : un substrat (11), une plaque de couvercle (12) et un adhésif d'encapsulation (13), une région d'affichage (111) et une région de non-affichage (114) entourant la zone d'affichage (111) sont définies dans le substrat (11) ; la plaque de recouvrement (12) est disposée sur le substrat (11) au moyen de l'adhésif d'encapsulation (13) ; l'adhésif d'encapsulation (13) est situé dans la région de non-affichage (114) et est disposé autour de la région d'affichage (111) ; et le bord du substrat (11) et/ou le bord de la plaque de couvercle (12) situés à l'extérieur d'un anneau d'encerclement de l'adhésif d'encapsulation (13) sont formés avec une partie d'amincissement (112). Dans le procédé de découpe d'une carte mère pour obtenir le panneau d'affichage (100), il peut être garanti que la découpe n'affecte pas la qualité du panneau d'affichage (100).
(ZH)
一种显示面板(100)、显示装置(300)及显示面板(100)的制造方法,显示面板(100)包括:基板(11)、盖板(12)及封装胶(13),基板(11)上定义有显示区(111)和围绕显示区(111)的非显示区(114);盖板(12)通过封装胶(13)设置于基板(11)上;封装胶(13)位于非显示区(114)且围绕显示区(111)设置;位于封装胶(13)包围圈外侧的基板(11)边缘和/或盖板(12)边缘形成有薄化部(112)。对母板进行切割得到显示面板(100)的过程中,能够保证切割对显示面板(100)质量不构成影响。
Also published as
Latest bibliographic data on file with the International Bureau