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1. WO2020087408 - CIRCUIT BOARD AND SUPERCOMPUTER DEVICE

Publication Number WO/2020/087408
Publication Date 07.05.2020
International Application No. PCT/CN2018/113198
International Filing Date 31.10.2018
IPC
H05K 1/02 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
H05K 7/20 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
G06F 1/20 2006.01
GPHYSICS
06COMPUTING; CALCULATING OR COUNTING
FELECTRIC DIGITAL DATA PROCESSING
1Details not covered by groups G06F3/-G06F13/82
16Constructional details or arrangements
20Cooling means
CPC
G06F 1/20
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
FELECTRIC DIGITAL DATA PROCESSING
1Details not covered by groups G06F3/00G06F13/00 and G06F21/00
16Constructional details or arrangements
20Cooling means
G06F 2200/201
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
FELECTRIC DIGITAL DATA PROCESSING
2200Indexing scheme relating to G06F1/04 - G06F1/32
20Indexing scheme relating to G06F1/20
201Cooling arrangements using cooling fluid
H05K 1/0201
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
H05K 1/0204
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
0203Cooling of mounted components
0204using means for thermal conduction connection in the thickness direction of the substrate
H05K 1/0272
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
0272Adaptations for fluid transport, e.g. channels, holes
H05K 2201/064
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
06Thermal details
064Fluid cooling, e.g. by integral pipes
Applicants
  • 北京比特大陆科技有限公司 BITMAIN TECHNOLOGIES INC. [CN]/[CN]
Inventors
  • 吕政勇 LV, Zhengyong
Agents
  • 北京同立钧成知识产权代理有限公司 LEADER PATENT & TRADEMARK FIRM
Priority Data
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) CIRCUIT BOARD AND SUPERCOMPUTER DEVICE
(FR) CARTE DE CIRCUIT IMPRIMÉ ET DISPOSITIF SUPER-ORDINATEUR
(ZH) 电路板以及超算设备
Abstract
(EN)
Provided in the present application are a circuit board and a supercomputer device, wherein the circuit board comprises a circuit board body, and the circuit board body is provided thereon with at least one hole; the at least one hole is filled with a heat dissipation post. By means of providing one or more holes on the circuit board body, each hole is filled with a heat dissipation post. When heat dissipation is performed on the circuit board, heat dissipation may be performed by means of the holes on the circuit board body and the heat dissipation posts in the holes such that heat inside of the circuit board may be transferred out by means of the heat dissipation posts inside of the holes, thereby achieving heat dissipation for the circuit board; thus, heat dissipation for the circuit board may be accelerated, and a large amount of heat inside of the circuit board may be carried away, which ensures that the circuit board and the components on the circuit board are not damaged by high temperatures and which ensures the normal operation of the circuit board and the components on the circuit board.
(FR)
La présente invention concerne une carte de circuit imprimé et un dispositif super-ordinateur, la carte de circuit imprimé comprenant un corps de carte de circuit imprimé et le corps de carte de circuit imprimé étant pourvu d'au moins un trou ; le ou les trous étant chargés d'un support de dissipation thermique. Au moyen d'un ou de plusieurs trous sur le corps de carte de circuit imprimé, chaque trou est chargé d'un support de dissipation thermique. Lors d'une dissipation thermique sur la carte de circuit imprimé, une dissipation thermique peut se faire au moyen des trous sur le corps de la carte de circuit imprimé et des supports de dissipation thermique dans les trous de telle sorte que la chaleur à l'intérieur de la carte de circuit imprimé peut être évacuée à l'extérieur au moyen des supports de dissipation thermique à l'intérieur des trous, permettant d'obtenir une dissipation thermique pour la carte de circuit imprimé ; ainsi, la dissipation de la chaleur pour la carte de circuit imprimé peut être accélérée et une grande quantité de chaleur à l'intérieur de la carte de circuit imprimé peut être évacuée, ce qui garantit l’absence d’endommagement de la carte de circuit imprimé et des composants sur la carte de circuit imprimé par des températures élevées et assure le fonctionnement normal de la carte de circuit imprimé et des composants sur la carte de circuit imprimé.
(ZH)
本申请提供了一种电路板以及超算设备,其中,该电路板包括电路板本体,电路板本体上设置有至少一个孔;至少一个孔中填充有散热柱。通过在电路板本体上设置有一个或多个孔,每一个孔中填充有散热柱。在对电路板进行散热时,可以通过电路板本体上孔和孔中的散热柱进行散热,使得电路板内部的热量能够通过孔中的散热柱传递出去,进而实现对电路板的散热;可以加快电路板的散热,并且可以带走电路板中的大量热量,保证电路板和电路板上的元器件不被高温所损伤,保障电路板和电路板上的元器件的正常工作。
Also published as
CN201880002413.X
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