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1. WO2020072938 - METHODS OF FORMING MEMS DIAPHRAGMS INCLUDING CORRUGATIONS

Publication Number WO/2020/072938
Publication Date 09.04.2020
International Application No. PCT/US2019/054752
International Filing Date 04.10.2019
IPC
B81C 1/00 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
1Manufacture or treatment of devices or systems in or on a substrate
B81B 3/00 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
3Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
CPC
B81B 2201/0257
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
2201Specific applications of microelectromechanical systems
02Sensors
0257Microphones or microspeakers
B81B 2201/0264
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
2201Specific applications of microelectromechanical systems
02Sensors
0264Pressure sensors
B81B 2203/0127
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
2203Basic microelectromechanical structures
01Suspended structures, i.e. structures allowing a movement
0127Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function
B81B 3/0021
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
3Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
0018Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators
0021Transducers for transforming electrical into mechanical energy or vice versa
B81C 1/00134
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
1Manufacture or treatment of devices or systems in or on a substrate
00015for manufacturing microsystems
00134comprising flexible or deformable structures
B81C 1/00158
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
1Manufacture or treatment of devices or systems in or on a substrate
00015for manufacturing microsystems
00134comprising flexible or deformable structures
00158Diaphragms, membranes
Applicants
  • KNOWLES ELECTRONICS, LLC [US]/[US]
Inventors
  • LEE, Sung, Bok
  • NADERYAN, Vahid
  • YU, Bing
  • KUNTZMAN, Michael
  • MA, Yunfei
  • PEDERSEN, Michael
Agents
  • BELDEN, Brett, P.
  • GUNDERSEN, Jeffrey, S.
Priority Data
62/742,16405.10.2018US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) METHODS OF FORMING MEMS DIAPHRAGMS INCLUDING CORRUGATIONS
(FR) PROCÉDÉS DE FORMATION DE DIAPHRAGMES MEMS COMPRENANT DES ONDULATIONS
Abstract
(EN)
A method of forming an acoustic transducer comprises providing a substrate and depositing a first structural layer on the substrate. The first structural layer is selectively etched to form at least one of an enclosed trench or an enclosed pillar thereon. A second structural layer is deposited on the first structural layer and includes a depression or a bump corresponding to the enclosed trench or pillar, respectively. At least the second structural layer is heated to a temperature above a glass transition temperature of the second structural layer causing the second structural layer to reflow. A diaphragm layer is deposited on the second structural layer such that the diaphragm layer includes at least one of a downward facing corrugation corresponding to the depression or an upward facing corrugation corresponding to the bump. The diaphragm layer is released, thereby forming a diaphragm suspended over the substrate.
(FR)
L'invention porte sur un procédé de formation d'un transducteur acoustique comprenant la fourniture d'un substrat et le dépôt d'une première couche structurale sur le substrat. La première couche structurale est sélectivement gravée pour former au moins une tranchée fermée ou un pilier fermé sur celle-ci. Une seconde couche structurale est déposée sur la première couche structurale et comprend une dépression ou une bosse correspondant à la tranchée ou au pilier fermé, respectivement. Au moins la seconde couche structurale est chauffée à une température supérieure à une température de transition vitreuse de la seconde couche structurale provoquant la refusion de la seconde couche structurelle. Une couche de diaphragme est déposée sur la seconde couche structurale de telle sorte que la couche de diaphragme comprend au moins une ondulation orientée vers le bas correspondant à la dépression ou une ondulation orientée vers le haut correspondant à la bosse. La couche de diaphragme est libérée, formant ainsi un diaphragme suspendu sur le substrat.
Latest bibliographic data on file with the International Bureau