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1. WO2020072422 - APPARATUS FOR SUPPORTING DEBONDING AND DEBONDING METHOD USING THE SAME

Publication Number WO/2020/072422
Publication Date 09.04.2020
International Application No. PCT/US2019/053960
International Filing Date 01.10.2019
IPC
H01L 21/67 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/683 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
683for supporting or gripping
H01L 21/52 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
52Mounting semiconductor bodies in containers
CPC
H01L 21/67092
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67011Apparatus for manufacture or treatment
67092Apparatus for mechanical treatment
H01L 21/6838
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
683for supporting or gripping
6838with gripping and holding devices using a vacuum; Bernoulli devices
Applicants
  • CORNING INCORPORATED [US]/[US]
Inventors
  • KONG, Bokyung
  • LEE, JooYoung
Agents
  • BROOKINS, Irene L.
Priority Data
10-2018-011836004.10.2018KR
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) APPARATUS FOR SUPPORTING DEBONDING AND DEBONDING METHOD USING THE SAME
(FR) APPAREIL DE SUPPORT DE DÉCOLLEMENT ET PROCÉDÉ DE DÉCOLLEMENT L'UTILISANT
Abstract
(EN)
An apparatus for supporting a process of debonding a carrier glass sheet and an ultrathin glass sheet. A suction plate includes a plurality of suction hole portions defining suction holes for suction-holding a glass laminate seated thereon and at least one recess portion defining at least one recess accommodating at least one device layer protruding from one surface of an ultrathin glass sheet of the glass laminate. A plurality of suction cups are fitted to the plurality of suction hole portions, respectively, such that the plurality of suction cups are elastically compressible, in response to contact pressure of the ultrathin glass sheet and the device layer. A vacuum pump is connected to the plurality of suction hole portions to apply negative pressure to the plurality of suction hole portions. A controller controls the vacuum pump to adjust the negative pressure applied to the plurality of suction hole portions.
(FR)
L'invention concerne un appareil de support d'un processus de décollement d'une feuille de verre de support et d'une feuille de verre ultra-mince. Une plaque d'aspiration comprend une pluralité de parties de trou d'aspiration définissant des trous d'aspiration destinés à maintenir par aspiration un stratifié de verre y reposant et au moins une partie d'évidement définissant au moins un évidement recevant au moins une couche de dispositif faisant saillie à partir d'une surface d'une feuille de verre ultra-mince du stratifié de verre. Une pluralité de ventouses sont montées sur la pluralité de parties de trou d'aspiration, respectivement, de telle sorte que la pluralité de ventouses sont élastiquement compressibles, en réponse à une pression de contact de la feuille de verre ultra-mince et de la couche de dispositif. Une pompe à vide est reliée à la pluralité de parties de trou d'aspiration pour appliquer une pression négative à la pluralité de parties de trou d'aspiration. Un dispositif de commande commande la pompe à vide pour ajuster la pression négative appliquée à la pluralité de parties de trou d'aspiration.
Also published as
Latest bibliographic data on file with the International Bureau